Inventor · disambiguated record
Mathias Boettcher
Also filed as: BOETTCHER MATHIAS
4 granted patents·2 pending applications·110 citations·filing 1998–2007
78Inventor score
Top patents by PatentIndex Score
6 records- 0181US6191479B1Decoupling capacitor configuration for integrated circuit chipADVANCED MICRO DEVICES INC·Filed 1999·Granted Feb 20, 2001·70 cites·37 claims
- 0271US6639314B2Solder bump structure and a method of forming the sameADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 28, 2003·20 cites·25 claims
- 0345US6162718AHigh speed bump plating/formingADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 19, 2000·16 cites·20 claims
- 0441US2008225503A1Electronic system with integrated circuit device and passive componentQIMONDA AG·Filed 2007·Application pending·0 cites
- 0533US2002075020A1Test cell structure for estimating electrical characteristics of closely-spaced bond pads formed on a substrateFiled 2001·Application pending·0 cites
- 0630US6306748B1Bump scrub after platingADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 23, 2001·4 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →