Inventor · disambiguated record
Marcus Böhm
Also filed as: BÖHM MARCUS
1 granted patent·6 pending applications·0 citations·filing 2022–2024
13Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0172US2025054843A1Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing MethodINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0258US2025079275A1Package with transistor chip between carrier and conductive structure and with thermally conductive electrically insulating layerINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0353US2024395676A1Package with Single Integral Body Carrying Two Transistor Chips with Half Bridge ConfigurationINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0452US2023361009A1Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0551US2024162205A1Power semiconductor package and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0651US2024243092A1Semiconductor package in a source-down configuration by use of vertical connectorsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0750US12482730B2Package for a lateral power transistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Nov 25, 2025·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Marcus Böhm files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →