Inventor · disambiguated record
Mark Bohr
Also filed as: BOHR MARK · BOHR MARK T
164 granted patents·30 pending applications·3,215 citations·filing 1980–2025
99Inventor score
Top patents by PatentIndex Score
194 records- 0198US11887891B2Self-aligned contactsINTEL CORP·Filed 2023·Granted Jan 30, 2024·2 cites·20 claims
- 0298US11616015B2Integrated circuit device with back-side interconnection to deep source/drain semiconductorINTEL CORP·Filed 2020·Granted Mar 28, 2023·3 cites·19 claims
- 0398US8436404B2Self-aligned contactsBOHR MARK T·Filed 2009·Granted May 7, 2013·148 cites·30 claims
- 0498US6671947B2Method of making an interposerINTEL CORP·Filed 2001·Granted Jan 6, 2004·133 cites·5 claims
- 0598US6617681B1Interposer and method of making sameINTEL CORP·Filed 1999·Granted Sep 9, 2003·130 cites·8 claims
- 0697US11222863B2Techniques for die stacking and associated configurationsINTEL CORP·Filed 2016·Granted Jan 11, 2022·21 cites·16 claims
- 0797US10886217B2Integrated circuit device with back-side interconnection to deep source/drain semiconductorINTEL CORP·Filed 2016·Granted Jan 5, 2021·20 cites·20 claims
- 0897US9508821B2Self-aligned contactsINTEL CORP·Filed 2015·Granted Nov 29, 2016·13 cites·3 claims
- 0997US9466565B2Self-aligned contactsINTEL CORP·Filed 2015·Granted Oct 11, 2016·24 cites·18 claims
- 1097US9054178B2Self-aligned contactsBOHR MARK T·Filed 2014·Granted Jun 9, 2015·30 cites·12 claims
- 1197US8258057B2Copper-filled trench contact for transistor performance improvementKUHN KELIN J·Filed 2006·Granted Sep 4, 2012·53 cites·13 claims
- 1297US7494858B2Transistor with improved tip profile and method of manufacture thereofINTEL CORP·Filed 2005·Granted Feb 24, 2009·104 cites·15 claims
- 1396US9831306B2Self-aligned gate edge and local interconnect and method to fabricate sameINTEL CORP·Filed 2013·Granted Nov 28, 2017·29 cites·45 claims
- 1496US9461143B2Gate contact structure over active gate and method to fabricate samePETHE ABHIJIT JAYANT·Filed 2012·Granted Oct 4, 2016·62 cites·28 claims
- 1596US8450165B2Semiconductor device having tipless epitaxial source/drain regionsBOHR MARK T·Filed 2007·Granted May 28, 2013·37 cites·3 claims
- 1696US7491988B2Transistors with increased mobility in the channel zone and method of fabricationINTEL CORP·Filed 2004·Granted Feb 17, 2009·139 cites·28 claims
- 1796US7348675B2Microcircuit fabrication and interconnectionINTEL CORP·Filed 2005·Granted Mar 25, 2008·35 cites·7 claims
- 1896US6653563B2Alternate bump metallurgy bars for power and ground routingINTEL CORP·Filed 2001·Granted Nov 25, 2003·124 cites·5 claims
- 1995US9093513B2Self-aligned contactsBOHR MARK T·Filed 2013·Granted Jul 28, 2015·12 cites·14 claims
- 2095US7821044B2Transistor with improved tip profile and method of manufacture thereofINTEL CORP·Filed 2008·Granted Oct 26, 2010·32 cites·34 claims
- 2194US10770587B2Semiconductor device having tipless epitaxial source/drain regionsINTEL CORP·Filed 2019·Granted Sep 8, 2020·5 cites·20 claims
- 2294US10319812B2Self-aligned gate edge and local interconnect and method to fabricate sameINTEL CORP·Filed 2017·Granted Jun 11, 2019·9 cites·30 claims
- 2394US9129958B23D integrated circuit package with window interposerMALLIK DEBENDRA·Filed 2011·Granted Sep 8, 2015·17 cites·24 claims
- 2494US8766372B2Copper-filled trench contact for transistor performance improvementKUHN KELIN J·Filed 2012·Granted Jul 1, 2014·15 cites·18 claims
- 2594US8013368B2Replacement gates to enhance transistor strainINTEL CORP·Filed 2008·Granted Sep 6, 2011·16 cites·5 claims
- 2694US7541239B2Selective spacer formation on transistors of different classes on the same deviceINTEL CORP·Filed 2006·Granted Jun 2, 2009·26 cites·14 claims
- 2794US7470620B2Microcircuit fabrication and interconnectionINTEL CORP·Filed 2008·Granted Dec 30, 2008·26 cites·6 claims
- 2894US6919238B2Silicon on insulator (SOI) transistor and methods of fabricationINTEL CORP·Filed 2002·Granted Jul 19, 2005·82 cites·40 claims
- 2994US6624032B2Structure and process flow for fabrication of dual gate floating body integrated MOS transistorsINTEL CORP·Filed 2002·Granted Sep 23, 2003·85 cites·13 claims
- 3094US5708291ASilicide agglomeration fuse deviceINTEL CORP·Filed 1995·Granted Jan 13, 1998·131 cites·22 claims
- 3193US11139241B2Integrated circuit device with crenellated metal trace layoutINTEL CORP·Filed 2016·Granted Oct 5, 2021·6 cites·13 claims
- 3293US8101485B2Replacement gates to enhance transistor strainBOHR MARK T·Filed 2005·Granted Jan 24, 2012·16 cites·14 claims
- 3393US7943468B2Penetrating implant for forming a semiconductor deviceINTEL CORP·Filed 2008·Granted May 17, 2011·20 cites·9 claims
- 3493US7276801B2Designs and methods for conductive bumpsINTEL CORP·Filed 2003·Granted Oct 2, 2007·56 cites·24 claims
- 3593US5536675AIsolation structure formation for semiconductor circuit fabricationINTEL CORP·Filed 1995·Granted Jul 16, 1996·154 cites·25 claims
- 3692US11522048B2Gate-all-around integrated circuit structures having source or drain structures with epitaxial nubsINTEL CORP·Filed 2019·Granted Dec 6, 2022·6 cites·20 claims
- 3792US9142510B23D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approachLEE KEVIN J·Filed 2011·Granted Sep 22, 2015·17 cites·19 claims
- 3891US10930557B2Self-aligned contactsINTEL CORP·Filed 2020·Granted Feb 23, 2021·2 cites·12 claims
- 3991US9449913B23D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon viasLEE KEVIN J·Filed 2011·Granted Sep 20, 2016·18 cites·22 claims
- 4091US6982225B2Interposer and method of making sameINTEL CORP·Filed 2003·Granted Jan 3, 2006·34 cites·7 claims
- 4191US6933222B2Microcircuit fabrication and interconnectionINTEL CORP·Filed 2003·Granted Aug 23, 2005·53 cites·7 claims
- 4291US6686247B1Self-aligned contacts to gatesINTEL CORP·Filed 2002·Granted Feb 3, 2004·56 cites·6 claims
- 4390US11024601B2HyperchipINTEL CORP·Filed 2017·Granted Jun 1, 2021·4 cites·22 claims
- 4490US10325840B2Metal on both sides with power distributed through the siliconINTEL CORP·Filed 2015·Granted Jun 18, 2019·6 cites·26 claims
- 4590US9276112B2Semiconductor device having tipless epitaxial source/drain regionsBOHR MARK T·Filed 2013·Granted Mar 1, 2016·7 cites·18 claims
- 4690US6258700B1Silicide agglomeration fuse deviceINTEL CORP·Filed 1999·Granted Jul 10, 2001·85 cites·3 claims
- 4790US5969404ASilicide agglomeration deviceINTEL CORP·Filed 1997·Granted Oct 19, 1999·91 cites·28 claims
- 4889US9899255B2Via blocking layerINTEL CORP·Filed 2014·Granted Feb 20, 2018·8 cites·25 claims
- 4988US11894359B2Distributed semiconductor die and package architectureINTEL CORP·Filed 2022·Granted Feb 6, 2024·1 cites·23 claims
- 5088US10192783B2Gate contact structure over active gate and method to fabricate sameINTEL CORP·Filed 2016·Granted Jan 29, 2019·4 cites·18 claims
Showing the top 50 of 194 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →