Inventor · disambiguated record
Mario A. Bolanos
Also filed as: BOLANOS MARIO A · BOLANOS MARIO ANTONIO
9 granted patents·1 pending application·154 citations·filing 1995–2009
89Inventor score
Top patents by PatentIndex Score
10 records- 0177US5891377ADambarless leadframe for molded component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Apr 6, 1999·49 cites·14 claims
- 0264US5949132ADambarless leadframe for molded component encapsulationTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 7, 1999·28 cites·9 claims
- 0357US5965078AMethod for manufacturing prepackaged molding compound for component encapsulationTEXAS INSTRUMENTS INC·Filed 1997·Granted Oct 12, 1999·17 cites·4 claims
- 0456US5955115APre-packaged liquid molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Sep 21, 1999·24 cites·10 claims
- 0552US5888443AMethod for manufacturing prepackaged molding compound for component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Mar 30, 1999·14 cites·16 claims
- 0646US2010159644A1Low-cost flip-chip interconnect with an integrated wafer-applied photo-sensitive adhesive and metal-loaded epoxy paste systemDUNNE RAJIV CARL·Filed 2009·Application pending·0 cites
- 0737US5644168AMechanical interlocking of fillers and epoxy/resinTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 1, 1997·10 cites·16 claims
- 0834US5912024ASproutless pre-packaged molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Jun 15, 1999·6 cites·5 claims
- 0931US6531083B1Sproutless pre-packaged molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1995·Granted Mar 11, 2003·4 cites·8 claims
- 1029US5885506APre-packaged molding for component encapsulationTEXAS INSTRUMENTS INC·Filed 1996·Granted Mar 23, 1999·2 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →