Inventor · disambiguated record
Manabu Bonkohara
Also filed as: BONKOHARA MANABU
18 granted patents·2 pending applications·1,457 citations·filing 1976–2013
96Inventor score
Top patents by PatentIndex Score
20 records- 0194US6188127B1Semiconductor packing stack module and method of producing the sameNEC CORP·Filed 1996·Granted Feb 13, 2001·226 cites·12 claims
- 0294US5805422ASemiconductor package with flexible board and method of fabricating the sameNEC CORP·Filed 1997·Granted Sep 8, 1998·214 cites·10 claims
- 0393US5892271ASemiconductor deviceNEC CORP·Filed 1996·Granted Apr 6, 1999·151 cites·12 claims
- 0493US5883426AStack moduleNEC CORP·Filed 1997·Granted Mar 16, 1999·410 cites·7 claims
- 0590US9386685B2Interposer and semiconductor module using the sameBONKOHARA MANABU·Filed 2011·Granted Jul 5, 2016·13 cites·16 claims
- 0690US4714952ACapacitor built-in integrated circuit packaged unit and process of fabrication thereofNEC CORP·Filed 1985·Granted Dec 22, 1987·119 cites·22 claims
- 0787US5570274AHigh density multichip module packaging structureNEC CORP·Filed 1994·Granted Oct 29, 1996·94 cites·14 claims
- 0880US4080485AFine gold wire for use in connection in a semiconductor deviceNIPPON ELECTRIC CO·Filed 1976·Granted Mar 21, 1978·38 cites·10 claims
- 0978US8300143B2Solid-state imaging device, method of fabricating the same, and camera moduleBONKOHARA MANABU·Filed 2007·Granted Oct 30, 2012·9 cites·28 claims
- 1078US5834338AChip carrier semiconductor device assembly and a method for forming the sameNEC CORP·Filed 1996·Granted Nov 10, 1998·48 cites·2 claims
- 1172US9282638B2Electrode, electrode material, and electrode formation methodZYCUBE CO LTD·Filed 2013·Granted Mar 8, 2016·3 cites·6 claims
- 1272US4763409AMethod of manufacturing semiconductor deviceNEC CORP·Filed 1986·Granted Aug 16, 1988·44 cites·14 claims
- 1366US5686763ADevice module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristicsNEC CORP·Filed 1995·Granted Nov 11, 1997·29 cites·18 claims
- 1460US4138691AFramed lead assembly for a semiconductor device comprising insulator reinforcing strips supported by a frame and made integral with lead stripsNIPPON ELECTRIC CO·Filed 1977·Granted Feb 6, 1979·21 cites·14 claims
- 1556US5602419AChip carrier semiconductor device assemblyNEC CORP·Filed 1994·Granted Feb 11, 1997·21 cites·8 claims
- 1645US5763295ADevice module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristicsNEC CORP·Filed 1997·Granted Jun 9, 1998·11 cites·27 claims
- 1742US8907459B2Three-dimensional semiconductor integrated circuit device and method of fabricating the sameBONKOHARA MANABU·Filed 2007·Granted Dec 9, 2014·0 cites·20 claims
- 1842US2013313687A1Through via/the buried via elrctrolde material and the said via structure and the said via manufacturing methodZYCUBE CO LTD·Filed 2013·Application pending·0 cites
- 1939US2014015119A1Semiconductor device/electronic component mounting structureBONKOHARA MANABU·Filed 2011·Application pending·0 cites
- 2030US5063435ASemiconductor deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 1989·Granted Nov 5, 1991·6 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →