Inventor · disambiguated record
Marian Sebastian Broll
Also filed as: BROLL MARIAN SEBASTIAN
2 granted patents·2 pending applications·0 citations·filing 2019–2023
24Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
4 records- 0151US11410950B2Semiconductor substrate having a bond pad material based on aluminumINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 0250US11756923B2High density and durable semiconductor device interconnectINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0339US2024404982A1Power semiconductor module having a metallic clip with ultrasonically welded contact regions and method of producing the power semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0425US2019312008A1Arrangements and Method for Providing a Bond ConnectionINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →