Inventor · disambiguated record
Mao-Yen Chang
Also filed as: CHANG MAO-YEN
16 granted patents·14 pending applications·16 citations·filing 2018–2025
89Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD28CEDARS DIGITAL PTE LTD1TAIWAN SEMICONDUCTOR MAMUFACTURING CO LTD1
Top patents by PatentIndex Score
30 records- 0198US11848300B2Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·4 cites·20 claims
- 0297US11424213B2Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0392US11646255B2Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
- 0485US2025349793A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0583US12278208B2Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0683US2025096203A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0782US2025323182A1Semiconductor packages and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US11004827B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·2 cites·20 claims
- 0981US10461023B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·4 cites·20 claims
- 1081US2025219010A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1178US12166015B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1278US2025349815A1Novel structure integrated with optical interface engineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1378US2024290703A1Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1477US12014976B2Chip package structure including a silicon substrate interposer and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1577US2025329703A1Trimming and sawing processes in the formation of wafer-form packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1675US2025323211A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1774US2025323107A1Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1874US2024371813A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1973US12406961B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 2071US11942451B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 2171US11646296B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 2271US2025087652A1Structure integrated with optical interface engineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2370US12500219B2Trimming and sawing processes in the formation of wafer-form packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 2470US12107064B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 2570US2023387039A1Semicondcutor packages and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2668US2025348889A1Automated carbon asset network system and carbon asset management methodCEDARS DIGITAL PTE LTD·Filed 2024·Application pending·0 cites
- 2767US12512451B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2861US12374592B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·14 claims
- 2955US11322421B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 3053US2024019486A1Alignment Mark Design for Wafer-Level Testing and Method Forming the SameTAIWAN SEMICONDUCTOR MAMUFACTURING CO LTD·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mao-Yen Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →