Inventor · disambiguated record
Mahmud Halim Chowdhury
Also filed as: CHOWDHURY MAHMUD · CHOWDHURY MAHMUD HALIM
8 granted patents·4 pending applications·9 citations·filing 2017–2024
79Inventor score
Files withTEXAS INSTRUMENTS INC12
Top patents by PatentIndex Score
12 records- 0189US12009336B2Packages with electrical fusesTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 11, 2024·3 cites·19 claims
- 0276US11495524B2QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making sameTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 8, 2022·2 cites·21 claims
- 0376US11021786B2Copper passivationTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 1, 2021·2 cites·38 claims
- 0475US11031364B2Nanoparticle backside die adhesion layerTEXAS INSTRUMENTS INC·Filed 2018·Granted Jun 8, 2021·2 cites·8 claims
- 0574US2024421120A1Package for stress sensitive component and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0669US12087673B2QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making sameTEXAS INSTRUMENTS INC·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0764US11676930B2Nanoparticle backside die adhesion layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 13, 2023·0 cites·18 claims
- 0862US12074134B2Package for stress sensitive component and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 0960US2025336886A1Integrated circuit (ic) with exposed active circuitryTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1060US2024194574A1Process for thin film capacitor integrationTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1149US11948871B2Process for thin film capacitor integrationTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1237US2019206741A1Method and structure to eliminate substrate coupling in common drain devicesTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →