Inventor · disambiguated record
Mark G. Courtney
Also filed as: COURTNEY MARK G · COURTNEY MARK GERARD
20 granted patents·942 citations·filing 1986–2001
97Inventor score
Files withIBM20
Top patents by PatentIndex Score
20 records- 0196US5623394AApparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Apr 22, 1997·121 cites·18 claims
- 0294US6333563B1Electrical interconnection package and method thereofIBM·Filed 2000·Granted Dec 25, 2001·85 cites·21 claims
- 0393US6283359B1Method for enhancing fatigue life of ball grid arraysIBM·Filed 2000·Granted Sep 4, 2001·53 cites·5 claims
- 0493US5724729AMethod and apparatus for cooling of chips using a plurality of customized thermally conductive materialsIBM·Filed 1996·Granted Mar 10, 1998·71 cites·18 claims
- 0592US5604978AMethod for cooling of chips using a plurality of materialsIBM·Filed 1995·Granted Feb 25, 1997·67 cites·17 claims
- 0683US5819402AMethod for cooling of chips using blind holes with customized depthIBM·Filed 1997·Granted Oct 13, 1998·63 cites·16 claims
- 0782US6158644AMethod for enhancing fatigue life of ball grid arraysIBM·Filed 1998·Granted Dec 12, 2000·43 cites·9 claims
- 0881US6333104B1Conductive polymer interconnection configurationsIBM·Filed 2000·Granted Dec 25, 2001·21 cites·22 claims
- 0981US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1079US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 1178US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 1278US5757620AApparatus for cooling of chips using blind holes with customized depthIBM·Filed 1996·Granted May 26, 1998·50 cites·26 claims
- 1374US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 1474US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 1568US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 1667US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 1765US6858111B2Conductive polymer interconnection configurationsIBM·Filed 2001·Granted Feb 22, 2005·9 cites·17 claims
- 1860US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 1958US4715430AEnvironmentally secure and thermally efficient heat sink assemblyIBM·Filed 1986·Granted Dec 29, 1987·31 cites·16 claims
- 2046US6552529B1Method and apparatus for interim assembly electrical testing of circuit boardsIBM·Filed 2001·Granted Apr 22, 2003·3 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →