Inventor · disambiguated record
Matthew Michael Day
Also filed as: DAY MATTHEW MICHAEL
1 granted patent·2 pending applications·2 citations·filing 2020–2024
18Inventor score
Technology areasH10P
Files withSPTS TECHNOLOGIES LTD3
Top patents by PatentIndex Score
3 records- 0173US11545394B2Semiconductor wafer dicing processSPTS TECHNOLOGIES LTD·Filed 2020·Granted Jan 3, 2023·2 cites·12 claims
- 0244US2025210376A1Method of packaging semiconductor diesSPTS TECHNOLOGIES LTD·Filed 2024·Application pending·0 cites
- 0342US2024128066A1Apparatus and Method for Reducing Substrate Thickness and Surface RoughnessSPTS TECHNOLOGIES LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →