Inventor · disambiguated record
Masahiko Demura
Also filed as: DEMURA MASAHIKO
2 granted patents·4 pending applications·3 citations·filing 2000–2006
45Inventor score
Top patents by PatentIndex Score
6 records- 0153US6444061B1Process for producing heat-resistant intermetallic compound ni3al foil having room-temperature ductility and heat-resistant intermetallic compound ni3al foil having room-temperature ductilityAGENCY OF NAT RES INST FOR MET·Filed 2000·Granted Sep 3, 2002·3 cites·7 claims
- 0249US2006185772A1Process for producing heat-resistant intermetallic compound Ni3Al foil having room-temperature ductility and heat-resistant intermetallic compound Ni3Al foil having room-temperature ductilityHIRANO TOSHIYUKI·Filed 2006·Application pending·0 cites
- 0338US2005194069A1Process for producing heat-resistant intermetallic compound Ni3Al foil having room-temperature ductility and heat-resistant intermetallic compound Ni3Al foil having room-temperature ductilityFiled 2005·Application pending·0 cites
- 0437US8129304B2Intermetallic compound Ni3Al catalyst for reforming methanol and methanol reforming method using sameXU YA·Filed 2005·Granted Mar 6, 2012·0 cites·9 claims
- 0536US2004048088A1Process for producing heat-resistant intermetallic compound Ni3Al foil having room-temperature ductility and heat-resistant intermetallic compound Ni3Al foil having room-temperature ductilityFiled 2003·Application pending·0 cites
- 0635US2003136480A1Process for producing heat-resistant intermetallic compound Ni3Al foil having room-temperature ductility and heat-resistant intermetallic compound Ni3Al foil having room-temperature ductilityFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →