Inventor · disambiguated record
Masahiko Denda
Also filed as: DENDA MASAHIKO
12 granted patents·184 citations·filing 1980–1991
91Inventor score
Top patents by PatentIndex Score
12 records- 0190US4438368APlasma treating apparatusMITSUBISHI ELECTRIC CORP·Filed 1981·Granted Mar 20, 1984·88 cites·2 claims
- 0265US5217911AMethod of producing a semiconductor structure including a Schottky junctionMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 8, 1993·26 cites·3 claims
- 0352US4496964AMOSFET Light detecting device having a Schottky junctionMITSUBISHI ELECTRIC CORP·Filed 1981·Granted Jan 29, 1985·12 cites·5 claims
- 0451US4381595AProcess for preparing multilayer interconnectionMITSUBISHI ELECTRIC CORP·Filed 1980·Granted May 3, 1983·16 cites·2 claims
- 0547US4535530AProcess for manufacturing a semiconductor memory deviceMITSUBISHI ELECTRIC CORP·Filed 1984·Granted Aug 20, 1985·10 cites·3 claims
- 0641US4524374ADevice for detecting infrared raysMITSUBISHI ELECTRIC CORP·Filed 1981·Granted Jun 18, 1985·8 cites·5 claims
- 0737US4454166AProcess for preparing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1983·Granted Jun 12, 1984·8 cites·6 claims
- 0835US5060038ACharge sweep solid-state image sensorMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Oct 22, 1991·4 cites·27 claims
- 0930US4871405AMethod of bonding a semiconductor to a package with a low and high viscosity bonding agentAGENCY IND SCIENCE TECHN·Filed 1988·Granted Oct 3, 1989·3 cites·5 claims
- 1029US4924297ASemiconductor device package structureAGENCY IND SCIENCE TECHN·Filed 1988·Granted May 8, 1990·2 cites·4 claims
- 1129US4893171ASemiconductor device with resin bonding to support structureDIRECTOR GENERAL AGENTY OF IND·Filed 1988·Granted Jan 9, 1990·6 cites·4 claims
- 1228US4589189AMethod for producing a Schottky barrier light detecting deviceMITSUBISHI ELECTRIC CORP·Filed 1984·Granted May 20, 1986·1 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Masahiko Denda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →