Inventor · disambiguated record
Mark Daniel Derwin
Also filed as: DERWIN MARK · DERWIN MARK DANIEL
2 granted patents·2 pending applications·27 citations·filing 1996–2023
61Inventor score
Top patents by PatentIndex Score
4 records- 0173US2024174623A1Build UP Film Curable CompositionsAGC MULTI MAT AMERICA INC·Filed 2023·Application pending·0 cites
- 0273US2024174802A1Build UP Film Curable CompositionsAGC MULTI MAT AMERICA INC·Filed 2023·Application pending·0 cites
- 0348US5731547ACircuitized substrate with material containment means and method of making sameIBM·Filed 1996·Granted Mar 24, 1998·18 cites·39 claims
- 0438US5827386AMethod for forming a multi-layered circuitized substrate memberIBM·Filed 1996·Granted Oct 27, 1998·9 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when Mark Daniel Derwin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →