Inventor · disambiguated record
Markus Dinkel
Also filed as: DINKEL MARKUS
25 granted patents·10 pending applications·60 citations·filing 2005–2024
93Inventor score
Files withINFINEON TECHNOLOGIES AG24INFINEON TECHNOLOGIES AUSTRIA AG5SCHAEFFLER TECHNOLOGIES AG3DINKEL MARKUS1GOLLER BERND1
Top patents by PatentIndex Score
35 records- 0192US9681558B2Module with integrated power electronic circuitry and logic circuitryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 13, 2017·24 cites·13 claims
- 0287US11600558B2Plurality of transistor packages with exposed source and drain contacts mounted on a carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 7, 2023·2 cites·14 claims
- 0385US10566260B2SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Feb 18, 2020·4 cites·19 claims
- 0482US9564423B2Power package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·5 cites·17 claims
- 0579US11302610B2Semiconductor package and method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Apr 12, 2022·2 cites·8 claims
- 0676US11728309B2Clip having locking recess for connecting an electronic component with a carrier in a packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 15, 2023·1 cites·21 claims
- 0776US9564578B2Semiconductor package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·3 cites·20 claims
- 0876US7732937B2Semiconductor package with mold lock ventINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jun 8, 2010·7 cites·6 claims
- 0975US9385059B2Overmolded substrate-chip arrangement with heat sinkINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 5, 2016·3 cites·19 claims
- 1073US11915999B2Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling elementINFINEON TECHNOLOGIES AG·Filed 2023·Granted Feb 27, 2024·0 cites·20 claims
- 1172US9881853B2Semiconductor package having a source-down configured transistor die and a drain-down configured transistor dieINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 30, 2018·2 cites·16 claims
- 1269US12308339B2Method of manufacturing a package using a clip having at least one locking recessINFINEON TECHNOLOGIES AG·Filed 2023·Granted May 20, 2025·0 cites·11 claims
- 1368US9171777B2Semiconductor device and method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 27, 2015·2 cites·14 claims
- 1466US11776882B2Method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Oct 3, 2023·0 cites·22 claims
- 1561US10168391B2Multi-functional interconnect module and carrier with multi-functional interconnect module attached theretoINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 1, 2019·1 cites·25 claims
- 1661US2023407425A1Treatment method and process for valve seatSCHAEFFLER TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1760US11342252B2Leadframe leads having fully plated end facesINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1860US8466009B2Method of fabricating a semiconductor package with mold lock openingGOLLER BERND·Filed 2010·Granted Jun 18, 2013·2 cites·14 claims
- 1960US2024279762A1Method for producing a rolling element bearing component, rolling element bearing component, and rolling element bearingSCHAEFFLER TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2060US2025286011A1Semiconductor package with hybrid interconnect clipINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2159US2025218914A1Package with component-carrying intermediate structure and additional carrier having reference potential structureINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2258US10903133B2Method of producing an SMD package with top side coolingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Jan 26, 2021·0 cites·19 claims
- 2358US8120161B2Semiconductor module including semiconductor chips coupled to external contact elementsOTREMBA RALF·Filed 2007·Granted Feb 21, 2012·2 cites·23 claims
- 2453US2023095545A1Semiconductor Packages and Methods for Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2551US2023230903A1Semiconductor chip, chip system, method of forming a semiconductor chip, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2648US9570433B2Semiconductor device and method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 14, 2017·0 cites·20 claims
- 2747US10796986B2Leadframe leads having fully plated end facesINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 6, 2020·0 cites·19 claims
- 2847US2021035876A1Semiconductor package including a cavity in its package bodyINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2945US9922904B2Semiconductor device including lead frames with downsetINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 20, 2018·0 cites·20 claims
- 3045US2025178066A1Method for producing rolling bearing components with a high degree of toughnessSCHAEFFLER TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 3144US9935027B2Electronic device including a metal substrate and a semiconductor module embedded in a laminateINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 3, 2018·0 cites·19 claims
- 3243US2007168075A1Method and installation for processing waste paperDINKEL MARKUS·Filed 2005·Application pending·0 cites
- 3341US10699987B2SMD package with flat contacts to prevent bottleneckINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 30, 2020·0 cites·19 claims
- 3437US2014167043A1Semiconductor device and method for manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2012·Application pending·0 cites
- 3536US10813229B2Electronic module having an electrically insulating structure with material having a low modulus of elasticityINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 20, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →