Inventor · disambiguated record
Marc Dittes
Also filed as: Dittes Marc · Dittes Marc Stephan
11 granted patents·2 pending applications·26 citations·filing 2015–2024
86Inventor score
Top patents by PatentIndex Score
13 records- 0197US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0289US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 0387US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 0481US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 0581US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 0679US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 0779US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 0878US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 0965US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 1058US10816742B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2018·Granted Oct 27, 2020·0 cites·8 claims
- 1147US10411000B2Microelectronic package with illuminated backside exteriorINTEL IP CORP·Filed 2016·Granted Sep 10, 2019·0 cites·20 claims
- 1245US10181439B2Substrate and method for fabrication thereofINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 15, 2019·0 cites·18 claims
- 1335US2019121041A1Optical fiber connection on package edgeINTEL IP CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →