Inventor · disambiguated record
Maohua Du
Also filed as: DU MAOHUA
7 granted patents·7 pending applications·9 citations·filing 2014–2024
75Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8TONGFU MICROELECTRONICS CO LTD5TRULY HUIZHOU SMART DISPLAY LTD1
Top patents by PatentIndex Score
14 records- 0183US9269647B2Semiconductor package having heat dissipating memberSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 23, 2016·6 cites·20 claims
- 0273US10338353B2Wafer level camera moduleSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 2, 2019·2 cites·20 claims
- 0358US9806066B2Semiconductor package including exposed connecting stubsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 31, 2017·1 cites·18 claims
- 0458US2024321825A1Fan-out packaging method and packaging structure thereofTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2024321854A1Fan-out packaging method and packaging structure of stacked chips thereofTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2024321853A1Packaging method and packaging structure of multi-layer stacked high-bandwidth memoryTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2024321704A1Fan-out packaging method and packaging structure of stacked chips thereofTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0858US2024321821A1Packaging method and packaging structure of multi-layer stacked memoryTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0956US10690891B2Wafer level camera moduleSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 23, 2020·0 cites·20 claims
- 1041US11199923B2Touch display module and touch display screenTRULY HUIZHOU SMART DISPLAY LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 1141US10109602B2Package integrated with a power source moduleSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 23, 2018·0 cites·14 claims
- 1241US2015137389A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1338US2020083128A1Flexible packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1437US10453671B2Combined structure of flexible semiconductor device package and method of transporting the flexible semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 22, 2019·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →