Inventor · disambiguated record
Maricel Fabia Escaño
Also filed as: ESCANO MARICEL FABIA · ESCAÑO MARICEL FABIA
5 granted patents·3 pending applications·1 citations·filing 2019–2024
63Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC8
Top patents by PatentIndex Score
8 records- 0173US11239190B2Solder-metal-solder stack for electronic interconnectTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 1, 2022·1 cites·18 claims
- 0273US2024413114A1Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0364US2024234282A1Semiconductor chip packages having bond over active circuit (boac) structuresTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0459US11942407B2Semiconductor chip packages having bond over active circuit (BOAC) structuresTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·12 claims
- 0557US12027483B2Packaged semiconductor device with electroplated pillarsTEXAS INSTRUMENTS INC·Filed 2021·Granted Jul 2, 2024·0 cites·15 claims
- 0654US12100678B2Conductive members for die attach in flip chip packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Sep 24, 2024·0 cites·33 claims
- 0751US11094656B2Packaged semiconductor device with electroplated pillarsTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 17, 2021·0 cites·22 claims
- 0847US2025006573A1Open cavity sensorTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →