Inventor · disambiguated record
Mark Eskridge
Also filed as: ESKRIDGE MARK · ESKRIDGE MARK H
24 granted patents·4 pending applications·269 citations·filing 1994–2012
96Inventor score
Files withHONEYWELL INT INC16ESKRIDGE MARK6ESKRIDGE MARK H2BARDAHL MANUFACTURING CORP1BARDAHL MFG CORP1
Top patents by PatentIndex Score
28 records- 0193US7022543B2Capacitive pick-off and electrostatic rebalance accelerometer having equalized gas dampingHONEYWELL INT INC·Filed 2005·Granted Apr 4, 2006·30 cites·20 claims
- 0292US6935175B2Capacitive pick-off and electrostatic rebalance accelerometer having equalized gas dampingHONEYWELL INT INC·Filed 2003·Granted Aug 30, 2005·40 cites·20 claims
- 0386US7402905B2Methods of fabrication of wafer-level vacuum packaged devicesHONEYWELL INT INC·Filed 2006·Granted Jul 22, 2008·12 cites·11 claims
- 0485US9187313B2Anodically bonded strain isolatorESKRIDGE MARK·Filed 2012·Granted Nov 17, 2015·7 cites·18 claims
- 0584US6910379B2Out-of-plane compensation suspension for an accelerometerHONEYWELL INT INC·Filed 2003·Granted Jun 28, 2005·27 cites·22 claims
- 0680US7069784B1Pendulous in-plane MEMS accelerometer deviceHONEYWELL INT INC·Filed 2004·Granted Jul 4, 2006·20 cites·23 claims
- 0776US6949807B2Signal routing in a hermetically sealed MEMS deviceHONEYWELL INT INC·Filed 2003·Granted Sep 27, 2005·29 cites·20 claims
- 0875US8742557B2Die mounting stress isolatorESKRIDGE MARK H·Filed 2007·Granted Jun 3, 2014·8 cites·18 claims
- 0974US7420817B2MEMS device seal using liquid crystal polymerHONEYWELL INT INC·Filed 2006·Granted Sep 2, 2008·6 cites·20 claims
- 1072US8129801B2Discrete stress isolator attachment structures for MEMS sensor packagesESKRIDGE MARK H·Filed 2006·Granted Mar 6, 2012·6 cites·11 claims
- 1172US7932570B1Silicon tab edge mount for a wafer level packageHONEYWELL INT INC·Filed 2009·Granted Apr 26, 2011·5 cites·8 claims
- 1272US5470504ASiloxane polymer compositionsBARDAHL MANUFACTURING CORP·Filed 1994·Granted Nov 28, 1995·27 cites·25 claims
- 1371US6991957B2Micro-machined electromechanical system (MEMS) accelerometer device having arcuately shaped flexuresHONEYWELL INT INC·Filed 2004·Granted Jan 31, 2006·20 cites·18 claims
- 1468US6573224B2Two-cycle engine lubricant composition comprising an ester copolymer and a diesterBARDAHL MFG CORP·Filed 2001·Granted Jun 3, 2003·14 cites·10 claims
- 1566US8227879B2Systems and methods for mounting inertial sensorsESKRIDGE MARK·Filed 2010·Granted Jul 24, 2012·2 cites·9 claims
- 1664US6897538B2Micro-machined electromechanical system (MEMS) accelerometer device having arcuately shaped flexuresHONEYWELL INT INC·Filed 2002·Granted May 24, 2005·9 cites·20 claims
- 1762US7833829B2MEMS devices and methods of assembling micro electromechanical systems (MEMS)HONEYWELL INT INC·Filed 2008·Granted Nov 16, 2010·1 cites·16 claims
- 1860US8531040B1Controlled area solder bonding for diesESKRIDGE MARK·Filed 2012·Granted Sep 10, 2013·1 cites·20 claims
- 1959US8502327B1Systems and methods for conductive pillarsESKRIDGE MARK·Filed 2012·Granted Aug 6, 2013·1 cites·10 claims
- 2059US7830003B2Mechanical isolation for MEMS devicesHONEYWELL INT INC·Filed 2007·Granted Nov 9, 2010·2 cites·4 claims
- 2152US8039912B2Systems and methods for reduced stress anchorsHONEYWELL INT INC·Filed 2008·Granted Oct 18, 2011·0 cites·11 claims
- 2249US8240203B2MEMS devices and methods with controlled die bonding areasMAGENDANZ GALEN·Filed 2008·Granted Aug 14, 2012·2 cites·18 claims
- 2348US8383442B2Methods for reduced stress anchorsHONEYWELL INT INC·Filed 2011·Granted Feb 26, 2013·0 cites·5 claims
- 2448US2011042137A1Suspended lead frame electronic packageHONEYWELL INT INC·Filed 2009·Application pending·0 cites
- 2547US8505805B2Systems and methods for platinum ball bondingESKRIDGE MARK·Filed 2008·Granted Aug 13, 2013·0 cites·8 claims
- 2647US2010255622A1Systems and methods for affixing a silicon device to a support structureHONEYWELL INT INC·Filed 2009·Application pending·0 cites
- 2739US2013264755A1Methods and systems for limiting sensor motionESKRIDGE MARK·Filed 2012·Application pending·0 cites
- 2833US2005205951A1Flip chip bonded micro-electromechanical system (MEMS) deviceHONEYWELL INTERNATIOANL INC·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →