Inventor · disambiguated record
Masahiko Fujisawa
Also filed as: FUJISAWA MASAHIKO
24 granted patents·12 pending applications·316 citations·filing 1995–2024
95Inventor score
Files withAPIC YAMADA CORP12MITSUBISHI ELECTRIC CORP8RENESAS ELECTRONICS CORP7RENESAS TECH CORP4YAMAHA ROBOTICS CO LTD2
Top patents by PatentIndex Score
36 records- 0192US6593217B1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Jul 15, 2003·75 cites·12 claims
- 0291US5565708ASemiconductor device comprising composite barrier layerMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 15, 1996·107 cites·13 claims
- 0387US9406628B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Aug 2, 2016·7 cites·17 claims
- 0484US7884011B2Semiconductor device and method of manufacture thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 8, 2011·6 cites·2 claims
- 0583US7714413B2Semiconductor device and method of manufacture thereofRENESAS TECH CORP·Filed 2006·Granted May 11, 2010·10 cites·6 claims
- 0679US6624516B2Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layerMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 23, 2003·25 cites·6 claims
- 0778US7906848B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Mar 15, 2011·8 cites·16 claims
- 0877US9238314B2Method for resin molding and resin molding apparatusAPIC YAMADA CORP·Filed 2012·Granted Jan 19, 2016·3 cites·8 claims
- 0976US8169080B2Semiconductor device and method of manufacture thereofMORIMOTO NOBORU·Filed 2010·Granted May 1, 2012·5 cites·6 claims
- 1072US2025114984A1Method for manufacturing resin-sealed productAPIC YAMADA CORP·Filed 2024·Application pending·0 cites
- 1170US6664641B2Wiring structure for an integrated circuitMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 16, 2003·17 cites·5 claims
- 1269US2023215784A1Method of manufacturing a semiconductor device including interlayer insulating films having different youngs modulusRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1367US9738014B2Resin molding machineMAEYAMA TETSUYA·Filed 2011·Granted Aug 22, 2017·5 cites·16 claims
- 1467US6657265B2Semiconductor device and its manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 2, 2003·13 cites·6 claims
- 1565US6780769B2Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layerRENESAS TECH CORP·Filed 2003·Granted Aug 24, 2004·11 cites·7 claims
- 1662US12485586B2Mold clamping deviceYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·4 claims
- 1762US11699604B2Resin molding apparatusAPIC YAMADA CORP·Filed 2021·Granted Jul 11, 2023·0 cites·19 claims
- 1859US12240153B2Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed productAPIC YAMADA CORP·Filed 2021·Granted Mar 4, 2025·0 cites·15 claims
- 1959US2020211931A1Method of manufacturing a semiconductor device including interlayer insulating films having different young's modulusRENESAS ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 2058US12179395B2Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed productAPIC YAMADA CORP·Filed 2021·Granted Dec 31, 2024·0 cites·14 claims
- 2154US12479135B2Resin-sealing methodYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·6 claims
- 2254US2025038017A1Resin sealing deviceAPIC YAMADA CORP·Filed 2022·Application pending·0 cites
- 2352US2012032323A1Semiconductor device and method of manufacturing the sameMATSUMOTO MASAHIRO·Filed 2009·Application pending·0 cites
- 2451US11784069B2Resin molding apparatusAPIC YAMADA CORP·Filed 2021·Granted Oct 10, 2023·0 cites·9 claims
- 2551US6716731B2Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrateRENESAS TECH CORP·Filed 2001·Granted Apr 6, 2004·4 cites·8 claims
- 2650US6236090B1Semiconductor device and method for reducing contact resistance between an electrode and a semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 1999·Granted May 22, 2001·10 cites·4 claims
- 2750US2024149504A1Resin-sealing method and resin-sealing deviceAPIC YAMADA CORP·Filed 2021·Application pending·0 cites
- 2849US2021362382A1Resin molding deviceAPIC YAMADA CORP·Filed 2021·Application pending·0 cites
- 2949US2021362379A1Resin molding deviceAPIC YAMADA CORP·Filed 2021·Application pending·0 cites
- 3048US9607956B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Mar 28, 2017·0 cites·5 claims
- 3148US2021351045A1Resin molding apparatus and cleaning methodAPIC YAMADA CORP·Filed 2021·Application pending·0 cites
- 3245US6472700B2Semiconductor device with isolation insulator, interlayer insulation film, and a sidewall coating filmMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Oct 29, 2002·10 cites·14 claims
- 3342US2007262049A1Imprinting method and nano-imprinting apparatusAPIC YAMADA CORP·Filed 2007·Application pending·0 cites
- 3441US10475883B2Semiconductor device and method of manufacturing thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 12, 2019·0 cites·15 claims
- 3537US2004238963A1Semiconductor device having structure for connecting interconnect linesRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 3636US2003160331A1Interconnection structure between wiresMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →