Inventor · disambiguated record
Masayuki Furuhashi
Also filed as: FURUHASHI MASAYUKI
14 granted patents·4 pending applications·36 citations·filing 2003–2018
88Inventor score
Top patents by PatentIndex Score
18 records- 0184US8035178B2Solid-state imaging devicePANASONIC CORP·Filed 2008·Granted Oct 11, 2011·8 cites·11 claims
- 0277US9515145B2Vertical MOSFET device with steady on-resistanceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Dec 6, 2016·5 cites·24 claims
- 0375US10529799B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jan 7, 2020·2 cites·8 claims
- 0473US11189689B2Semiconductor device including an active region that includes a switchable current pathMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Nov 30, 2021·2 cites·18 claims
- 0570US7166516B2Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN or SiCNFUJITSU LTD·Filed 2003·Granted Jan 23, 2007·13 cites·15 claims
- 0667US10854762B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Dec 1, 2020·1 cites·16 claims
- 0755US8753951B2Method for manufacturing silicon carbide semiconductor deviceTANIOKA TOSHIKAZU·Filed 2010·Granted Jun 17, 2014·1 cites·18 claims
- 0854US2014055150A1Polynucleotide base sequence determination method and polynucleotide base sequence determination deviceKAWAI TOMOJI·Filed 2013·Application pending·0 cites
- 0953US6800538B2Semiconductor device fabrication method and semiconductor fabrication control methodFUJITSU LTD·Filed 2003·Granted Oct 5, 2004·4 cites·20 claims
- 1048US9935170B2Silicon carbide semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 3, 2018·0 cites·6 claims
- 1146US7261854B2Insert molding techniqueDENSO CORP·Filed 2004·Granted Aug 28, 2007·0 cites·9 claims
- 1245US2007072381A1Method for fabricating a semiconductor device including the use of a compound containing silicon and nitrogen to form an insulation film of SiN, SiCN or SiOCNFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1344US8282867B2Insert molding die, insert molding apparatus and insert molding methodARAI TSUYOSHI·Filed 2009·Granted Oct 9, 2012·0 cites·4 claims
- 1442US10002931B2Silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jun 19, 2018·0 cites·17 claims
- 1540US11557671B2Semiconductor device having trench gate electrodes formed in first pillars including source layers formed in the first pillars being deeper into the substrate than first source layers in second pillarsMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 17, 2023·0 cites·19 claims
- 1640US2016245790A1Device for thermally denaturing biomolecule and method for producing deviceUNIV OSAKA·Filed 2016·Application pending·0 cites
- 1736US2005126308A1Rotation detecting device and method of manufacturing sameDENSO CORP·Filed 2004·Application pending·0 cites
- 1834US9076761B2Silicon carbide semiconductor device and method for manufacturing silicon carbide semiconductor deviceWATANABE TOMOKATSU·Filed 2012·Granted Jul 7, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →