Inventor · disambiguated record
Masao Fushimi
Also filed as: FUSHIMI MASAO
0 granted patents·3 pending applications·0 citations·filing 2001–2008
Technology areasH10W
Files withSEKISUI CHEMICAL CO LTD2
Top patents by PatentIndex Score
3 records- 0150US2008268237A1Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film for tab, and prepregSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 0250US2008268257A1Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymide film, film for tab, and prepregSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 0336US2004053061A1Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepregFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →