Inventor · disambiguated record
Mao Guo
Also filed as: GUO MAO · Guo Mao Zhen
9 granted patents·8 pending applications·21 citations·filing 2010–2022
82Inventor score
Top patents by PatentIndex Score
17 records- 0191US10511008B2Battery contact with a surface textureTTI MACAO COMMERCIAL OFFSHORE LTD·Filed 2017·Granted Dec 17, 2019·6 cites·16 claims
- 0283US9859255B1Electronic device packageINTEL CORP·Filed 2016·Granted Jan 2, 2018·6 cites·23 claims
- 0380US10756072B2Conductive wire through-mold connection apparatus and methodINTEL CORP·Filed 2015·Granted Aug 25, 2020·4 cites·12 claims
- 0477US10748873B2Substrates, assembles, and techniques to enable multi-chip flip chip packagesINTEL CORP·Filed 2015·Granted Aug 18, 2020·3 cites·25 claims
- 0570US12046581B2Integrated circuit package with glass spacerINTEL CORP·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 0670US10192840B2Ball pad with a plurality of lobesINTEL CORP·Filed 2015·Granted Jan 29, 2019·2 cites·20 claims
- 0752US11393788B2Integrated circuit package with glass spacerINTEL CORP·Filed 2016·Granted Jul 19, 2022·0 cites·12 claims
- 0846US2016324487A1Wearable Personal Computer and Healthcare DevicesINTEL CORP·Filed 2014·Application pending·0 cites
- 0943US11373974B2Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger sizeINTEL CORP·Filed 2016·Granted Jun 28, 2022·0 cites·18 claims
- 1043US2011244167A1Thermal insulation core material and vacuum insulation panel and manufacturing process thereofCHONGQING ZAISHENG TECHNOLOGY DEV CO LTD·Filed 2010·Application pending·0 cites
- 1136US2019230788A1Substrate with stress relieving featuresINTEL CORP·Filed 2016·Application pending·0 cites
- 1236US2019355700A1Techniques for windowed substrate integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1336US2019229093A1Electronic device packageINTEL CORP·Filed 2016·Application pending·0 cites
- 1435US2019371766A1Integrated circuit die stacksINTEL CORP·Filed 2016·Application pending·0 cites
- 1533US10872832B2Pre-molded active IC of passive components to miniaturize system in packageINTEL CORP·Filed 2015·Granted Dec 22, 2020·0 cites·19 claims
- 1633US2020066701A1Stacked chip package having substrate interposer and wirebondsINTEL CORP·Filed 2016·Application pending·0 cites
- 1731US2018323172A1Eliminating die shadow effects by dummy die beams for solder joint reliability improvementINTEL CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Mao Guo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →