Inventor · disambiguated record
Masaaki Harazono
Also filed as: HARAZONO MASAAKI
13 granted patents·207 citations·filing 1996–2018
88Inventor score
Top patents by PatentIndex Score
13 records- 0194US6207259B1Wiring boardKYOCERA CORP·Filed 1999·Granted Mar 27, 2001·174 cites·10 claims
- 0274US8863377B2Method for manufacturing circuit board and method for manufacturing structure using the sameHARAZONO MASAAKI·Filed 2011·Granted Oct 21, 2014·5 cites·7 claims
- 0371US8890001B2Wiring board and mounting structure using the sameKYOCERA SLC TECHNOLOGIES CORP·Filed 2013·Granted Nov 18, 2014·4 cites·8 claims
- 0468US8735741B2Circuit board and mounting structure using the sameHARAZONO MASAAKI·Filed 2011·Granted May 27, 2014·3 cites·7 claims
- 0568US7951447B2Method and apparatus for manufacturing prepreg sheet and prepreg sheetKYOCERA CORP·Filed 2008·Granted May 31, 2011·1 cites·6 claims
- 0659US8957321B2Printed circuit board, mount structure thereof, and methods of producing theseKYOCERA SLC TECHNOLOGIES CORP·Filed 2012·Granted Feb 17, 2015·1 cites·15 claims
- 0759US8012561B2Fiber-reinforced resin and method for manufacturing the sameKYOCERA CORP·Filed 2008·Granted Sep 6, 2011·2 cites·7 claims
- 0853US8273203B2Method and apparatus for manufacturing prepreg sheet and prepreg sheetHARAZONO MASAAKI·Filed 2011·Granted Sep 25, 2012·0 cites·14 claims
- 0949US5744848APackage for housing a photosemiconductor deviceKYOCERA CORP·Filed 1996·Granted Apr 28, 1998·17 cites·4 claims
- 1046US10172235B1Wiring board and method for manufacturing the sameKYOCERA CORP·Filed 2018·Granted Jan 1, 2019·0 cites·4 claims
- 1145US10306769B2Wiring board and manufacturing method for sameKYOCERA CORP·Filed 2017·Granted May 28, 2019·0 cites·2 claims
- 1244US9913372B2Wiring boardKYOCERA CORP·Filed 2017·Granted Mar 6, 2018·0 cites·4 claims
- 1343US10602622B2Wiring boardKYOCERA CORP·Filed 2018·Granted Mar 24, 2020·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →