Inventor · disambiguated record
Makiko Hasegawa
Also filed as: HASEGAWA MAKIKO
6 granted patents·236 citations·filing 1996–1998
87Inventor score
Files withMITSUBISHI ELECTRIC CORP6
Top patents by PatentIndex Score
6 records- 0180US6107687ASemiconductor device having interconnection and adhesion layersMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 22, 2000·63 cites·1 claims
- 0278US6184124B1Method of making embedded wiring systemMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 6, 2001·50 cites·9 claims
- 0374US5892286ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 6, 1999·45 cites·18 claims
- 0474US5793112AMultilevel embedded wiring systemMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 11, 1998·42 cites·18 claims
- 0569US6039808ACVD apparatus for Cu formationMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 21, 2000·32 cites·5 claims
- 0634US6303495B2Method of forming thin copper film and semiconductor device with thin copper filmMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 16, 2001·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →