Inventor · disambiguated record
Masaru Hatabe
Also filed as: HATABE MASARU
7 granted patents·2 pending applications·0 citations·filing 2015–2025
67Inventor score
Top patents by PatentIndex Score
9 records- 0173US2025377594A1Resist composition, method for producing resist pattern and method for producing plated molded articleSUMITOMO CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0259US12388035B2Structure comprising under barrier metal and solder layer, and method for producing structureISHIHARA CHEMICAL CO LTD·Filed 2021·Granted Aug 12, 2025·0 cites·4 claims
- 0359US2025231484A1Resist composition, method for producing resist pattern and method for producing plated molded articleSUMITOMO CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0458US12448690B2Treatment method after plating with Sn or Sn alloyISHIHARA CHEMICAL CO LTD·Filed 2021·Granted Oct 21, 2025·0 cites·7 claims
- 0553US11946153B2Copper or copper alloy electroplating bathISHIHARA CHEMICAL CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·13 claims
- 0647US11993862B2Structure including copper plating layer or copper alloy plating layerISHIHARA CHEMICAL CO LTD·Filed 2020·Granted May 28, 2024·0 cites·7 claims
- 0744US11052637B2Structure containing Sn layer or Sn alloy layerISHIHARA CHEMICAL CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·1 claims
- 0828US10062657B2Method for manufacturing alloy bumpISHIHARA CHEMICAL CO LTD·Filed 2015·Granted Aug 28, 2018·0 cites·3 claims
- 0927US11939691B2Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bathISHIHARA CHEMICAL CO LTD·Filed 2017·Granted Mar 26, 2024·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →