Inventor · disambiguated record
Masako Hatase
Also filed as: HATASE MASAKO
15 granted patents·9 pending applications·6 citations·filing 2013–2024
85Inventor score
Top patents by PatentIndex Score
24 records- 0193US12104245B2Compound, thin-film forming raw material that contains said compound, and method of manufacturing thin filmADEKA CORP·Filed 2020·Granted Oct 1, 2024·3 cites·5 claims
- 0274US9896468B2Metal alkoxide compound, thin-film-forming material, method for producing thin film, and alcohol compoundADEKA CORP·Filed 2013·Granted Feb 20, 2018·1 cites·7 claims
- 0372US2024352044A1Metal alkoxide compound, thin film forming raw material, and thin film production methodADEKA CORP·Filed 2024·Application pending·0 cites
- 0469US12486573B2Thin-film forming raw material, thin-film and method of producing thin-filmADEKA CORP·Filed 2022·Granted Dec 2, 2025·0 cites·7 claims
- 0569US11623935B2Raw material for forming thin film by atomic layer deposition method, method of producing thin film, and alkoxide compoundADEKA CORP·Filed 2019·Granted Apr 11, 2023·0 cites·2 claims
- 0668US10155784B2Alcohol compoundADEKA CORP·Filed 2018·Granted Dec 18, 2018·0 cites·1 claims
- 0767US10167304B2Ruthenium compound, material for thin film formation, and process for thin film formationADEKA CORP·Filed 2014·Granted Jan 1, 2019·0 cites·7 claims
- 0866US12264168B2Ruthenium compound, thin-film forming raw material, and method of producing thin filmADEKA CORP·Filed 2020·Granted Apr 1, 2025·0 cites·3 claims
- 0965US9663538B2Aluminum compound, thin-film forming raw material, and method for producing thin filmADEKA CORP·Filed 2013·Granted May 30, 2017·1 cites·18 claims
- 1065US2020140463A1Metal alkoxide compound, thin film forming raw material, and thin film production methodADEKA CORP·Filed 2018·Application pending·0 cites
- 1160US9472345B2Aluminum precursor, method of forming a thin film and method of forming a capacitor using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 18, 2016·1 cites·20 claims
- 1257US2018282358A1Alkoxide compound, thin film-forming starting material, thin film formation method, and alcohol compoundADEKA CORP·Filed 2018·Application pending·0 cites
- 1356US2024425975A1Thin-film forming raw material, method of producing thin-film, thin-film, and molybdenum compoundADEKA CORP·Filed 2022·Application pending·0 cites
- 1455US12276022B2Alkoxide compound, thin-film forming raw material, and method of producing thin-filmADEKA CORP·Filed 2021·Granted Apr 15, 2025·0 cites·1 claims
- 1555US10011623B2Alkoxide compound, thin film-forming starting material, and thin film formation methodADEKA CORP·Filed 2015·Granted Jul 3, 2018·0 cites·2 claims
- 1653US10364495B2Method for producing a thin filmADEKA CORP·Filed 2017·Granted Jul 30, 2019·0 cites·4 claims
- 1749US11760771B2Ruthenium compound, raw material for forming thin film, and method for producing thin filmADEKA CORP·Filed 2018·Granted Sep 19, 2023·0 cites·3 claims
- 1849US2020148706A1Metal alkoxide compound, thin-film-forming raw material and method of producing thin filmADEKA CORP·Filed 2018·Application pending·0 cites
- 1948US2025019820A1Thin-film forming material for use in atomic layer deposition, thin-film, method of producing thin-film, and ruthenium compoundADEKA CORP·Filed 2022·Application pending·0 cites
- 2047US12509764B2Thin-film forming raw material used in atomic layer deposition method, and method of producing thin-filmADEKA CORP·Filed 2021·Granted Dec 30, 2025·0 cites·2 claims
- 2146US2024018655A1Method of producing thin-filmADEKA CORP·Filed 2021·Application pending·0 cites
- 2246US2024018654A1Method of producing thin-filmADEKA CORP·Filed 2021·Application pending·0 cites
- 2344US10351584B2Alkoxide compound, raw material for forming thin film, method for manufacturing thin film, and alcohol compoundADEKA CORP·Filed 2015·Granted Jul 16, 2019·0 cites·3 claims
- 2440US2017050998A1Cobalt compound, thin film-forming raw material, and method for producing thin filmADEKA CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →