Inventor · disambiguated record
Masashi Hayakawa
Also filed as: HAYAKAWA MASASHI
21 granted patents·2 pending applications·19 citations·filing 2009–2024
90Inventor score
Top patents by PatentIndex Score
23 records- 0193US12103082B2Method for producing green compact and method for producing sintered bodyTOHO TITANIUM CO LTD·Filed 2020·Granted Oct 1, 2024·2 cites·11 claims
- 0288US9941582B2Switch module, front-end module, and driving method for switch moduleMURATA MANUFACTURING CO·Filed 2016·Granted Apr 10, 2018·8 cites·17 claims
- 0379US9413413B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2014·Granted Aug 9, 2016·5 cites·11 claims
- 0473US10014902B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2017·Granted Jul 3, 2018·2 cites·14 claims
- 0569US11770153B2Radio-frequency moduleMURATA MANUFACTURING CO·Filed 2021·Granted Sep 26, 2023·0 cites·19 claims
- 0667US12510494B2X-ray imaging apparatus and subject holding mechanismSHIMADZU CORP·Filed 2023·Granted Dec 30, 2025·0 cites·15 claims
- 0765US11177850B2Radio-frequency moduleMURATA MANUFACTURING CO·Filed 2020·Granted Nov 16, 2021·0 cites·24 claims
- 0864US11336278B2Switching circuit and high frequency moduleMURATA MANUFACTURING CO·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 0962US10966358B2Component mounting deviceFUJI CORP·Filed 2014·Granted Mar 30, 2021·1 cites·11 claims
- 1059US8945690B2Method and apparatus for mass-producing DLC filmsSAITO TAKAO·Filed 2009·Granted Feb 3, 2015·0 cites·9 claims
- 1158US12482086B2Defect inspection apparatusSHIMADZU CORP·Filed 2021·Granted Nov 25, 2025·0 cites·17 claims
- 1256US2024339973A1High frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 1355US11956003B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2021·Granted Apr 9, 2024·0 cites·16 claims
- 1454US11509344B2Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 1554US11456761B2Radio-frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2021·Granted Sep 27, 2022·0 cites·20 claims
- 1651US10651884B2Radio-frequency module with switch IC having a ground electrode for isolating between a common terminal and selection terminalsMURATA MANUFACTURING CO·Filed 2016·Granted May 12, 2020·0 cites·21 claims
- 1751US10461798B2High-frequency moduleMURATA MANUFACTURING CO·Filed 2018·Granted Oct 29, 2019·0 cites·20 claims
- 1848US11502305B2Titanium-based porous body and method of producing the sameTOHO TITANIUM CO LTD·Filed 2018·Granted Nov 15, 2022·0 cites·12 claims
- 1941US11330749B2Component-mounting deviceFUJI CORP·Filed 2018·Granted May 10, 2022·0 cites·7 claims
- 2037US10879096B2Die component supply deviceFUJI CORP·Filed 2016·Granted Dec 29, 2020·0 cites·17 claims
- 2137US2013083439A1High-frequency moduleMURATA MANUFACTURING CO·Filed 2012·Application pending·0 cites
- 2233US10269500B2Circuit moduleHAYAKAWA MASASHI·Filed 2012·Granted Apr 23, 2019·0 cites·8 claims
- 2333US8401495B2High-frequency module and communication apparatus using the moduleHAYAKAWA MASASHI·Filed 2009·Granted Mar 19, 2013·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →