Inventor · disambiguated record
Masaaki Hayama
Also filed as: HAYAMA MASAAKI
23 granted patents·7 pending applications·841 citations·filing 1994–2009
97Inventor score
Top patents by PatentIndex Score
30 records- 0196US6998532B2Electronic component-built-in moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·124 cites·23 claims
- 0293US6372158B1Conductive pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 16, 2002·67 cites·6 claims
- 0393US5609704AMethod for fabricating an electronic part by intaglio printingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Mar 11, 1997·87 cites·15 claims
- 0490US7180012B2Module partMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 20, 2007·66 cites·3 claims
- 0589US7161252B2Module componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 9, 2007·59 cites·14 claims
- 0688US6132543AMethod of manufacturing a packaging substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Oct 17, 2000·72 cites·21 claims
- 0787US6828670B2Module componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 7, 2004·40 cites·7 claims
- 0879US7161371B2Module partMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 9, 2007·25 cites·68 claims
- 0978US6378424B1Electronic part fabricated by intaglio printing and a method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 30, 2002·19 cites·19 claims
- 1078US6347584B1Method of manufacturing electronic components using intaglio plate having dual releasing layersMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 19, 2002·21 cites·9 claims
- 1177US6310304B1Electronic part fabricated by intaglio printingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Oct 30, 2001·35 cites·20 claims
- 1276US6051448AMethod of manufacturing an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Apr 18, 2000·59 cites·24 claims
- 1375US6759925B2Radio-frequency hybrid switch moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jul 6, 2004·16 cites·11 claims
- 1475US6429114B1Method for fabricating a multilayer ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 6, 2002·32 cites·15 claims
- 1574US6985364B2Voltage converter moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 10, 2006·23 cites·20 claims
- 1671US7382628B2Circuit-component-containing moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 3, 2008·15 cites·12 claims
- 1771US7358445B1Circuit substrate and apparatus including the circuit substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 15, 2008·15 cites·9 claims
- 1870US6374733B1Method of manufacturing ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 23, 2002·32 cites·14 claims
- 1962US6846375B2Method of manufacturing multilayer ceramic wiring board and conductive paste for useMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 25, 2005·11 cites·20 claims
- 2057US7423222B2Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 9, 2008·5 cites·8 claims
- 2157US6861744B2Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depthsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 1, 2005·5 cites·10 claims
- 2251US2010025099A1Circuit board and method of manufacturing the samePANASONIC CORP·Filed 2009·Application pending·0 cites
- 2343US2008224815A1Electrostatic discharge protection component, and electronic component module using the sameINOUE TATSUYA·Filed 2008·Application pending·0 cites
- 2443US2008225449A1Electrostatic discharge protection component, and electronic component module using the sameINOUE TATSUYA·Filed 2008·Application pending·0 cites
- 2543US2008224816A1Electrostatic discharge protection component, and electronic component module using the sameINOUE TATSUYA·Filed 2008·Application pending·0 cites
- 2642US2004221449A1Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 2741US6514364B2Manufacturing method of wiring board, and conductive paste used thereinMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 4, 2003·9 cites·15 claims
- 2839US2002094604A1Method for fabricating a multilayer ceramic substrateFiled 2002·Application pending·0 cites
- 2938US2007200133A1Led assembly and manufacturing methodHASHIMOTO AKIRA·Filed 2006·Application pending·0 cites
- 3032US6141847AMethod of manufacturing composite electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Nov 7, 2000·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →