Inventor · disambiguated record
Marcel Heerman
Also filed as: HEERMAN MARCEL
16 granted patents·3 pending applications·307 citations·filing 1989–2003
94Inventor score
Files withSIEMENS AG9SIEMENS NV4SIEMENS N V AND INTERUNIVERSIT1SIEMENS PRODUCTION & LOGISTICS1SIEMENS SA1
Top patents by PatentIndex Score
19 records- 0191US6713719B1Method and device for laser drilling laminatesSIEMENS AG·Filed 2000·Granted Mar 30, 2004·60 cites·28 claims
- 0286US6610960B2Method for drilling micro-holes with a laser beamSIEMENS AG·Filed 2002·Granted Aug 26, 2003·49 cites·18 claims
- 0376US4985600APrinted circuit board having an injection molded substrateSIEMENS AG·Filed 1989·Granted Jan 15, 1991·34 cites·14 claims
- 0470US5929516APolymer stud grid arraySIEMENS NV·Filed 1995·Granted Jul 27, 1999·45 cites·10 claims
- 0569US6531679B2Method for the laser machining of organic materialsSIEMENS AG·Filed 2001·Granted Mar 11, 2003·13 cites·17 claims
- 0666US6861008B1Method and device for laser drilling organic materialsSIEMENS AG·Filed 2000·Granted Mar 1, 2005·12 cites·36 claims
- 0762US6639180B1Method for describing a predetermined desired course with a beam consisting of particles or waves and use of this methodSIEMENS AG·Filed 2000·Granted Oct 28, 2003·9 cites·10 claims
- 0860US6130478APolymer stud grid array for microwave circuit arrangementsSIEMENS NV·Filed 1996·Granted Oct 10, 2000·31 cites·10 claims
- 0953US6518088B1Polymer stud grid arraySIEMENS N V AND INTERUNIVERSIT·Filed 2000·Granted Feb 11, 2003·11 cites·4 claims
- 1049US6781215B2Intermediate base for a semiconductor module and a semiconductor module using the intermediate baseSIEMENS AG·Filed 2001·Granted Aug 24, 2004·4 cites·19 claims
- 1147US6696665B2Method for introducing plated-through holes into an electrically insulating base material having a metal layer on each sideSIEMENS AG·Filed 2001·Granted Feb 24, 2004·2 cites·16 claims
- 1247US6249048B1Polymer stud grid arraySIEMENS NV·Filed 1999·Granted Jun 19, 2001·15 cites·14 claims
- 1346US6576402B2Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structuresSIEMENS PRODUCTION & LOGISTICS·Filed 2001·Granted Jun 10, 2003·2 cites·8 claims
- 1440US6221229B1Method for forming metal conductor patterns on electrically insulating substrates and supportsSIEMENS SA·Filed 1998·Granted Apr 24, 2001·9 cites·20 claims
- 1539US6122172APolymer stud grid arraySIEMENS NV·Filed 1996·Granted Sep 19, 2000·11 cites·18 claims
- 1638US6783688B2Method and apparatus for structuring printed circuit boardsSIEMENS AG·Filed 2002·Granted Aug 31, 2004·0 cites·8 claims
- 1738US2003217996A1Method for simultaneous laser beam solderingFiled 2003·Application pending·0 cites
- 1834US2004251527A1Intermediate support for electronic components and method for solder contacting such an intermediate supportFiled 2002·Application pending·0 cites
- 1930US2004029361A1Method for producing semiconductor modules and a module produced according to said methodFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →