Inventor · disambiguated record
Matthias Hien
Also filed as: HIEN MATTHIAS · HIEN MATTHIAS RICHARD
7 granted patents·4 pending applications·6 citations·filing 2012–2025
73Inventor score
Top patents by PatentIndex Score
11 records- 0184US11329199B2Optoelectronic semiconductor chip, method of manufacturing an optoelectronic component and optoelectronic componentOSRAM OLED GMBH·Filed 2019·Granted May 10, 2022·4 cites·20 claims
- 0270US11545601B2Component and method for producing a componentOSRAM OLED GMBH·Filed 2019·Granted Jan 3, 2023·2 cites·20 claims
- 0370US2025324826A1Optoelectronic component and method for producing an optoelectronic componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2025·Application pending·0 cites
- 0456US12356768B2Optoelectronic component and method for producing an optoelectronic componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2020·Granted Jul 8, 2025·0 cites·20 claims
- 0551US12125773B2Lead frame assembly, method for producing a plurality of components, and componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2020·Granted Oct 22, 2024·0 cites·13 claims
- 0649US2023330926A1Method for Producing a Component, and ComponentAMS OSRAM INT GMBH·Filed 2021·Application pending·0 cites
- 0748US2012260509A1Hand held device having a rotational axisFANG DONG·Filed 2012·Application pending·0 cites
- 0847US12066166B2Optoelectronic lighting device and method for manufacturing an optoelectronic lighting deviceOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2019·Granted Aug 20, 2024·0 cites·14 claims
- 0945US12327803B2Optoelectronic semiconductor component and arrangementOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2019·Granted Jun 10, 2025·0 cites·8 claims
- 1045US2023275194A1Method for producing a component, and optoelectronic componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2021·Application pending·0 cites
- 1142US11462500B2Optoelectronic semiconductor device and method for producing optoelectronic semiconductor devicesOSRAM OLED GMBH·Filed 2019·Granted Oct 4, 2022·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →