Inventor · disambiguated record
Masayoshi Hirao
Also filed as: HIRAO MASAYOSHI
7 granted patents·1 pending application·22 citations·filing 2002–2024
79Inventor score
Files withMITSUBISHI ELECTRIC CORP8
Top patents by PatentIndex Score
8 records- 0182US11774476B2Input capacitance measurement circuit and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Oct 3, 2023·1 cites·19 claims
- 0271US10224388B2Wiring core structure, semiconductor evaluation device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Mar 5, 2019·2 cites·3 claims
- 0360US6831351B2Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base materialMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 14, 2004·10 cites·4 claims
- 0457US2025035689A1Measuring device for capacitance of semiconductor device and measurement jigMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0555US6788082B2Probe cardMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 7, 2004·8 cites·3 claims
- 0640US7057298B2Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base materialMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Jun 6, 2006·1 cites·3 claims
- 0737US6861730B2Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base materialMITSUBISHI ELECTRIC CORP·Filed 2004·Granted Mar 1, 2005·0 cites·3 claims
- 0835US10665670B2Semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted May 26, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →