Inventor · disambiguated record
Martin Honsberg-Riedl
Also filed as: HONSBERG-RIEDL MARTIN
7 granted patents·4 pending applications·22 citations·filing 1997–2013
78Inventor score
Files withSIEMENS AG4HONSBERG-RIEDL MARTIN2OSRAM GMBH2PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH2
Top patents by PatentIndex Score
11 records- 0161US7884554B2Ignition circuit for igniting a discharge lamp and method for igniting the discharge lampOSRAM GMBH·Filed 2006·Granted Feb 8, 2011·0 cites·20 claims
- 0248US2011074304A1Wirelessly supplied illumination meansOSRAM GMBH·Filed 2009·Application pending·0 cites
- 0345US7508290B2Inductive component and use of said componentSIEMENS AG·Filed 2003·Granted Mar 24, 2009·2 cites·20 claims
- 0441US6245187B1Mechanically firm glued connections between surfaces and the method for producing the sameSIEMENS AG·Filed 1997·Granted Jun 12, 2001·13 cites·24 claims
- 0540US8120269B2Circuit arrangement and method for operating a high-pressure discharge lampHONSBERG-RIEDL MARTIN·Filed 2006·Granted Feb 21, 2012·0 cites·19 claims
- 0638US2015062813A1Cooling deviceSIEMENS AG·Filed 2013·Application pending·0 cites
- 0737US8339057B2Circuit arrangement, and method for the operation of a high-pressure discharge lampHONSBERG-RIEDL MARTIN·Filed 2006·Granted Dec 25, 2012·0 cites·18 claims
- 0835US2004246683A1Electrical circuit arrangement comprised of a number of electrically interconnected circuit componentsFiled 2002·Application pending·0 cites
- 0932US7057375B2Power factor correctionPATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH·Filed 2003·Granted Jun 6, 2006·4 cites·9 claims
- 1031US6207732B1Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-rangeSIEMENS AG·Filed 1997·Granted Mar 27, 2001·3 cites·16 claims
- 1128US2006152201A1Electrical circuit for voltage transformation and use of said electrical circuitPATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →