Inventor · disambiguated record
Masahiko Hori
Also filed as: HORI MASAHIKO
19 granted patents·17 pending applications·587 citations·filing 1985–2022
94Inventor score
Files withTOSHIBA KK13OGASAWARA TADASHI6SUMITOMO TITANIUM CORP3TSUIN BADO KOGYO KK3SUMITOMO METAL IND2
Top patents by PatentIndex Score
36 records- 0196US5493151ASemiconductor device, lead frame and method for manufacturing semiconductor devicesTOSHIBA KK·Filed 1995·Granted Feb 20, 1996·213 cites·4 claims
- 0294US5703407AResin-sealed type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Dec 30, 1997·209 cites·5 claims
- 0384US7150069B2Electric vacuum cleanerTSUIN BADO KOGYO KK·Filed 2003·Granted Dec 19, 2006·37 cites·7 claims
- 0482US8872350B2Semiconductor device and manufacturing method thereofSAWACHI SHIGENORI·Filed 2012·Granted Oct 28, 2014·11 cites·12 claims
- 0573US5665651AProcess for encapsulating a semiconductor device and lead frameTOSHIBA KK·Filed 1995·Granted Sep 9, 1997·39 cites·6 claims
- 0668US5583371AResin-sealed semiconductor device capable of improving in heat radiation characteristics of resin-sealed semiconductor elementsTOSHIBA KK·Filed 1995·Granted Dec 10, 1996·38 cites·10 claims
- 0763US11769715B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0861US12094862B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Sep 17, 2024·0 cites·11 claims
- 0960US11990460B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted May 21, 2024·0 cites·13 claims
- 1056US12300682B2Semiconductor packageTOSHIBA KK·Filed 2022·Granted May 13, 2025·0 cites·14 claims
- 1155US11342249B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted May 24, 2022·0 cites·10 claims
- 1255US7648560B2Method for producing Ti or Ti alloy through reduction by CaOSAKA TITANIUM TECHNOLOGIES CO·Filed 2004·Granted Jan 19, 2010·3 cites·12 claims
- 1351US12389731B2Semiconductor device, method for manufacturing same, and substrateTOSHIBA KK·Filed 2022·Granted Aug 12, 2025·0 cites·15 claims
- 1451US6528749B2Switch attachment structureTSUIN BADO KOGYO KK·Filed 2001·Granted Mar 4, 2003·4 cites·10 claims
- 1550US11611009B2Semiconductor deviceTOSHIBA KK·Filed 2021·Granted Mar 21, 2023·0 cites·26 claims
- 1649US6375339B2Lighting apparatusTSUIN BADO KOGYO KK·Filed 2000·Granted Apr 23, 2002·3 cites·5 claims
- 1746US2006219053A1Method and apparatus for producing metalOGASAWARA TADASHI·Filed 2004·Application pending·0 cites
- 1845US2007131057A1Method for producing ti or ti alloy through reduction by caSUMITOMO TITANIUM CORP·Filed 2004·Application pending·0 cites
- 1945US2008110765A1Method For Producing MetalOGASAWARA TADASHI·Filed 2005·Application pending·0 cites
- 2043US2009101517A1Method for Producing Ti or Ti Alloy, and Pulling Electrolysis Method Applicable TheretoTAKEMURA KAZUO·Filed 2006·Application pending·0 cites
- 2143US2010089204A1Process for Producing Ti and Apparatus ThereforSUMITOMO TITANIUM CORP·Filed 2006·Application pending·0 cites
- 2243US2008217184A1Method and Apparatus for Producing Ti Through Reduction by CaSUMITOMO TITANIUM CORP·Filed 2005·Application pending·0 cites
- 2342US5897967AGalvannealed steel sheet and manufacturing method thereofSUMITOMO METAL IND·Filed 1997·Granted Apr 27, 1999·11 cites·8 claims
- 2442US2008053838A1Method for Production of Metal by Molten-Salt Electrolysis and Method for Production of Titanium MetalTOHO TITANIUM CO LTD·Filed 2005·Application pending·0 cites
- 2542US2008078679A1Method and Apparatus for Producing Metal by Molten-Salt ElectrolysisTOHO TITANIUM CO LTD·Filed 2005·Application pending·0 cites
- 2642US2009152122A1Method for electrolyzing molten salt, electrolytic cell, and process for producing ti using said methodOGASAWARA TADASHI·Filed 2006·Application pending·0 cites
- 2742US2007295167A1Method for Producing Ti or Ti Alloy Through Reduction by CaOGASAWARA TADASHI·Filed 2004·Application pending·0 cites
- 2841US6159622AGalvannealed steel sheet and manufacturing method thereofSUMITOMO METAL IND·Filed 1997·Granted Dec 12, 2000·9 cites·17 claims
- 2941US2010230471A1Bonding method and bonding deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3041US2019326248A1Semiconductor device and drive circuitTOSHIBA KK·Filed 2019·Application pending·0 cites
- 3141US2006049060A1Porous sintered compact of titanium oxide for production of metallic titanium through direct electrolytic process and process for producing the sameHORI MASAHIKO·Filed 2003·Application pending·0 cites
- 3239US2005202650A1Method of dividing a wafer which has a low-k film formed on dicing linesFiled 2005·Application pending·0 cites
- 3339US2008250901A1Method of High-Melting-Point Metal Separation and RecoveryOGASAWARA TADASHI·Filed 2006·Application pending·0 cites
- 3438US2007187255A1Method for producing ti or ti alloy through reduction by caENDOART SA·Filed 2005·Application pending·0 cites
- 3537US4685113ADriver isolating circuit for common bus-type transmission of local area networkMITSUBISHI CABLE IND LTD·Filed 1985·Granted Aug 4, 1987·10 cites·6 claims
- 3637US2007181435A1Method for producing ti or ti alloy through reduction by ca (as amended)OGASAWARA TADASHI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →