Inventor · disambiguated record
Masanao Horie
Also filed as: HORIE MASANAO
3 granted patents·1 pending application·21 citations·filing 2003–2009
66Inventor score
Technology areasH10W
Files withNEC ELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0183US7253515B2Semiconductor package featuring metal lid memberNEC ELECTRONICS CORP·Filed 2006·Granted Aug 7, 2007·15 cites·19 claims
- 0255US7317254B2Semiconductor device mounting structure for reducing thermal stress and warpageNEC ELECTRONICS CORP·Filed 2005·Granted Jan 8, 2008·2 cites·20 claims
- 0344US6955944B2Fabrication method for a semiconductor CSP type packageNEC ELECTRONICS CORP·Filed 2003·Granted Oct 18, 2005·4 cites·10 claims
- 0440US2009289352A1Semiconductor device and a method for manufacturing the semiconductor deviceNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →