Inventor · disambiguated record
Masayuki Horie
Also filed as: HORIE MASAYUKI
6 granted patents·3 pending applications·29 citations·filing 1979–2022
77Inventor score
Top patents by PatentIndex Score
9 records- 0182US9181609B2Welded steel pipe for linepipe having high compressive strength and excellent sour gas resistance and manufacturing method thereofISHIKAWA NOBUYUKI·Filed 2010·Granted Nov 10, 2015·4 cites·4 claims
- 0276US10443110B2High toughness and high tensile strength thick steel plate and production method thereforJFE STEEL CORP·Filed 2014·Granted Oct 15, 2019·1 cites·16 claims
- 0376US9089919B2Welded steel pipe for linepipe with high compressive strength and manufacturing method thereofNISHIMURA KIMIHIRO·Filed 2010·Granted Jul 28, 2015·3 cites·5 claims
- 0463US4293868ASemiconductor device, method of manufacturing the same and application thereofHITACHI LTD·Filed 1979·Granted Oct 6, 1981·19 cites·12 claims
- 0558US7978704B2Frame buffer monitoring method and deviceFUJITSU LTD·Filed 2006·Granted Jul 12, 2011·2 cites·18 claims
- 0653US2024362372A1Steel pipe out-of-roundness prediction model generation method, steel pipe out-of-roundness prediction method, steel pipe out-of-roundness control method, steel pipe manufacturing method, and steel pipe out-of-roundness prediction deviceJFE STEEL CORP·Filed 2022·Application pending·0 cites
- 0753US2024316613A1Steel pipe out-of-roundness prediction method, steel pipe out-of-roundness control method, steel pipe manufacturing method, steel pipe out-of-roundness prediction model generation method, and steel pipe out-of-roundness prediction deviceJFE STEEL CORP·Filed 2022·Application pending·0 cites
- 0836US7463169B264B/66B Encoding data generation method and circuitFUJITSU LTD·Filed 2007·Granted Dec 9, 2008·0 cites·10 claims
- 0935US2012305122A1Welded steel pipe for linepipe having high compressive strength and high fracture toughness and manufacturing method thereofISHIKAWA NOBUYUKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →