Inventor · disambiguated record
Makio Horikawa
Also filed as: HORIKAWA MAKIO
15 granted patents·28 citations·filing 2001–2010
88Inventor score
Top patents by PatentIndex Score
15 records- 0166US7533570B2Electrostatic-capacitance-type acceleration sensorMITSUBISHI ELECTRIC CORP·Filed 2006·Granted May 19, 2009·5 cites·8 claims
- 0260US7900515B2Acceleration sensor and fabrication method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Mar 8, 2011·3 cites·13 claims
- 0353US6958529B2Acceleration sensor and method of manufacture thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 25, 2005·6 cites·8 claims
- 0453US6900071B2Substrate and method for producing the same, and thin film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 31, 2005·4 cites·8 claims
- 0546US8304899B2Element wafer and method for manufacturing the sameOKUMURA MIKA·Filed 2008·Granted Nov 6, 2012·0 cites·9 claims
- 0646US6812568B2Electrode structure, and method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 2, 2004·3 cites·20 claims
- 0744US8505381B2Capacitive acceleration sensorYAMAGUCHI YASUO·Filed 2010·Granted Aug 13, 2013·0 cites·3 claims
- 0843US8193631B2Semiconductor device and method of manufacturing the semiconductor deviceSATO KIMITOSHI·Filed 2008·Granted Jun 5, 2012·0 cites·13 claims
- 0943US7041593B2Method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 9, 2006·2 cites·9 claims
- 1043US6905905B2Method of manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 14, 2005·2 cites·10 claims
- 1140US7495301B2Thin film accelerometerMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Feb 24, 2009·0 cites·7 claims
- 1240US7094620B2Semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Aug 22, 2006·1 cites·16 claims
- 1340US6784011B2Method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 31, 2004·2 cites·6 claims
- 1437US8618666B2Semiconductor device and method of manufacturing the sameOKUMURA MIKA·Filed 2010·Granted Dec 31, 2013·0 cites·10 claims
- 1527US7371600B2Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 13, 2008·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →