Inventor · disambiguated record
Marcus Hsu
Also filed as: HSU MARCUS · HSU MARCUS BERNARD
9 granted patents·4 pending applications·19 citations·filing 2013–2022
79Inventor score
Technology areasH10W
Files withQUALCOMM INC13
Top patents by PatentIndex Score
13 records- 0196US11682607B2Package having a substrate comprising surface interconnects aligned with a surface of the substrateQUALCOMM INC·Filed 2021·Granted Jun 20, 2023·8 cites·16 claims
- 0287US9484327B2Package-on-package structure with reduced heightQUALCOMM INC·Filed 2013·Granted Nov 1, 2016·10 cites·10 claims
- 0374US11404343B2Package comprising a substrate configured as a heat spreaderQUALCOMM INC·Filed 2020·Granted Aug 2, 2022·1 cites·30 claims
- 0456US12500187B2Package comprising an interconnection die located between substratesQUALCOMM INC·Filed 2022·Granted Dec 16, 2025·0 cites·25 claims
- 0553US11527498B2Bump pad structureQUALCOMM INC·Filed 2020·Granted Dec 13, 2022·0 cites·28 claims
- 0652US2023352390A1Package comprising a substrate with a bump pad interconnect comprising a trapezoid shaped cross sectionQUALCOMM INC·Filed 2022·Application pending·0 cites
- 0751US11552023B2Passive component embedded in an embedded trace substrate (ETS)QUALCOMM INC·Filed 2020·Granted Jan 10, 2023·0 cites·16 claims
- 0850US11784151B2Redistribution layer connectionQUALCOMM INC·Filed 2020·Granted Oct 10, 2023·0 cites·30 claims
- 0950US11456291B2Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methodsQUALCOMM INC·Filed 2020·Granted Sep 27, 2022·0 cites·24 claims
- 1048US2022375838A1Package comprising integrated devices coupled through a bridgeQUALCOMM INC·Filed 2021·Application pending·0 cites
- 1146US10804195B2High density embedded interconnects in substrateQUALCOMM INC·Filed 2018·Granted Oct 13, 2020·0 cites·24 claims
- 1246US2021280523A1Integrated circuit (ic) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methodsQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1337US2018350630A1Symmetric embedded trace substrateQUALCOMM INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →