Inventor · disambiguated record
Makarem A. Hussein
Also filed as: HUSSEIN MAKAREM · HUSSEIN MAKAREM A
32 granted patents·2 pending applications·997 citations·filing 1995–2022
98Inventor score
Top patents by PatentIndex Score
34 records- 0196US6365529B1Method for patterning dual damascene interconnects using a sacrificial light absorbing materialINTEL CORP·Filed 2000·Granted Apr 2, 2002·121 cites·20 claims
- 0294US6958547B2Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugsINTEL CORP·Filed 2003·Granted Oct 25, 2005·71 cites·19 claims
- 0393US7649239B2Dielectric spacers for metal interconnects and method to form the sameINTEL CORP·Filed 2006·Granted Jan 19, 2010·22 cites·7 claims
- 0493US7008872B2Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structuresINTEL CORP·Filed 2002·Granted Mar 7, 2006·59 cites·16 claims
- 0593US5714413AMethod of making a transistor having a deposited dual-layer spacer structureINTEL CORP·Filed 1995·Granted Feb 3, 1998·117 cites·23 claims
- 0692US6981380B2Thermoelectric cooling for microelectronic packages and diceINTEL CORP·Filed 2002·Granted Jan 3, 2006·51 cites·19 claims
- 0791US6329118B1Method for patterning dual damascene interconnects using a sacrificial light absorbing materialINTEL CORP·Filed 1999·Granted Dec 11, 2001·107 cites·8 claims
- 0890US8992806B2Antireflective coatings for via fill and photolithography applications and methods of preparation thereofLI BO·Filed 2011·Granted Mar 31, 2015·6 cites·27 claims
- 0989US6169024B1Process to manufacture continuous metal interconnectsINTEL CORP·Filed 1998·Granted Jan 2, 2001·90 cites·13 claims
- 1088US11387029B2Apparatus for transferring plurality of micro devices and methods of fabricationLUXNOUR TECH INC·Filed 2021·Granted Jul 12, 2022·2 cites·13 claims
- 1182US6406995B1Pattern-sensitive deposition for damascene processingINTEL CORP·Filed 1999·Granted Jun 18, 2002·72 cites·30 claims
- 1281US6908829B2Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal linesINTEL CORP·Filed 2002·Granted Jun 21, 2005·34 cites·22 claims
- 1379US6037255AMethod for making integrated circuit having polymer interlayer dielectricINTEL CORP·Filed 1999·Granted Mar 14, 2000·55 cites·15 claims
- 1478US8394701B2Dielectric spacers for metal interconnects and method to form the sameHUSSEIN MAKAREM A·Filed 2011·Granted Mar 12, 2013·5 cites·13 claims
- 1576US7923760B2Dielectric spacers for metal interconnects and method to form the sameINTEL CORP·Filed 2009·Granted Apr 12, 2011·5 cites·18 claims
- 1671US6384481B1Single step electroplating process for interconnect via fill and metal line patterningINTEL CORP·Filed 1999·Granted May 7, 2002·33 cites·5 claims
- 1771US6020266ASingle step electroplating process for interconnect via fill and metal line patterningINTEL CORP·Filed 1997·Granted Feb 1, 2000·33 cites·18 claims
- 1870US7071554B2Stress mitigation layer to reduce under bump stress concentrationINTEL CORP·Filed 2004·Granted Jul 4, 2006·16 cites·14 claims
- 1969US6774037B2Method integrating polymeric interlayer dielectric in integrated circuitsINTEL CORP·Filed 2002·Granted Aug 10, 2004·18 cites·22 claims
- 2068US7442675B2Cleaning composition and method of cleaning semiconductor substrateTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Oct 28, 2008·12 cites·6 claims
- 2166US8053159B2Antireflective coatings for via fill and photolithography applications and methods of preparation thereofHONEYWELL INT INC·Filed 2003·Granted Nov 8, 2011·6 cites·16 claims
- 2266US7659196B2Soluble hard mask for interlayer dielectric patterningINTEL CORP·Filed 2006·Granted Feb 9, 2010·3 cites·1 claims
- 2366US6649515B2Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structuresINTEL CORP·Filed 1998·Granted Nov 18, 2003·35 cites·14 claims
- 2465US7157380B2Damascene process for fabricating interconnect layers in an integrated circuitINTEL CORP·Filed 2003·Granted Jan 2, 2007·9 cites·18 claims
- 2563US12260989B2Methods of transferring micro light emitting diode devices using electromagnetic apparatus and methods of fabricationLUXNOUR TECH INC·Filed 2022·Granted Mar 25, 2025·0 cites·21 claims
- 2653US7078754B2Methods and apparatuses for producing a polymer memory deviceINTEL CORP·Filed 2004·Granted Jul 18, 2006·4 cites·11 claims
- 2749US7326981B2Methods and apparatuses for producing a polymer memory deviceINTEL CORP·Filed 2006·Granted Feb 5, 2008·0 cites·6 claims
- 2848US7166922B1Continuous metal interconnectsINTEL CORP·Filed 2000·Granted Jan 23, 2007·2 cites·6 claims
- 2947US6900063B2Methods and apparatuses for producing a polymer memory deviceINTEL CORP·Filed 2003·Granted May 31, 2005·2 cites·11 claims
- 3042US6720631B2Transistor having a deposited dual-layer spacer structureINTEL CORP·Filed 1997·Granted Apr 13, 2004·7 cites·16 claims
- 3142US2007231751A1Photoresist top coat out-of-band illumination filter for photolithographyBRISTOL ROBERT L·Filed 2006·Application pending·0 cites
- 3240US11056363B2Electromagnetic tool for transferring micro devices and methods of transferLUXNOUR TECH INC·Filed 2018·Granted Jul 6, 2021·0 cites·22 claims
- 3340US2009001594A1Airgap interconnect systemYOO HUI JAE·Filed 2007·Application pending·0 cites
- 3439US10984937B2Electromagnetic tool for transferring micro devices and methods of fabricationLUXNOUR TECH INC·Filed 2018·Granted Apr 20, 2021·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →