Inventor · disambiguated record
Masatsugu Ichikawa
Also filed as: ICHIKAWA MASATSUGU
38 granted patents·93 citations·filing 2006–2024
96Inventor score
Top patents by PatentIndex Score
38 records- 0193US10603889B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2018·Granted Mar 31, 2020·3 cites·15 claims
- 0293US8552448B2Light emitting deviceICHIKAWA MASATSUGU·Filed 2010·Granted Oct 8, 2013·19 cites·22 claims
- 0391US12261090B2Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrateNICHIA CORP·Filed 2024·Granted Mar 25, 2025·2 cites·17 claims
- 0490US9744754B2Method for manufacturing light distribution member, and method for manufacturing light emitting deviceNICHIA CORP·Filed 2014·Granted Aug 29, 2017·13 cites·16 claims
- 0589US11799065B2Method of producing heat dissipation substrate and method of producing composite substrateNICHIA CORP·Filed 2021·Granted Oct 24, 2023·2 cites·19 claims
- 0688US9293643B2Method of manufacturing light emitting device including light emitting element and wavelength converting memberNICHIA CORP·Filed 2014·Granted Mar 22, 2016·4 cites·10 claims
- 0788US8916399B2Method of manufacturing light emitting device including light emitting element and wavelength converting memberICHIKAWA MASATSUGU·Filed 2011·Granted Dec 23, 2014·5 cites·11 claims
- 0887US8980661B2Method for manufacturing light emitting deviceNICHIA CORP·Filed 2014·Granted Mar 17, 2015·5 cites·14 claims
- 0983US7963817B2Phosphor-containing molded member, method of manufacturing the same, and light emitting device having the sameNICHIA CORP·Filed 2008·Granted Jun 21, 2011·9 cites·18 claims
- 1082US9914288B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2014·Granted Mar 13, 2018·2 cites·2 claims
- 1182US8835951B2Light emitting deviceICHIKAWA MASATSUGU·Filed 2011·Granted Sep 16, 2014·7 cites·12 claims
- 1281US9941447B2Semiconductor light emitting device and method for producing the sameNICHIA CORP·Filed 2016·Granted Apr 10, 2018·3 cites·21 claims
- 1377US12002902B2Light emitting device, and method for manufacturing thereofNICHIA CORP·Filed 2022·Granted Jun 4, 2024·0 cites·13 claims
- 1476US12145349B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2021·Granted Nov 19, 2024·0 cites·16 claims
- 1576US10658811B2Optical component, light emitting device using the optical component, and method of manufacturing the optical componentNICHIA CORP·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 1675US10211379B2Semiconductor light emitting device and method for manufacturing the sameNICHIA CORP·Filed 2014·Granted Feb 19, 2019·2 cites·4 claims
- 1775US9257619B2Light-emitting device and manufacturing method thereofNICHIA CORP·Filed 2014·Granted Feb 9, 2016·2 cites·15 claims
- 1875US8647906B2Method for manufacturing a light emitting deviceNICHIA CORP·Filed 2013·Granted Feb 11, 2014·3 cites·8 claims
- 1973US10974492B2Light emitting device and method of manufacturing light emitting deviceNICHIA CORP·Filed 2020·Granted Apr 13, 2021·0 cites·15 claims
- 2071US8076694B2Nitride semiconductor element having a silicon substrate and a current passing regionNARUKAWA YUKIO·Filed 2006·Granted Dec 13, 2011·9 cites·8 claims
- 2169US11522104B2Light emitting device, and method for manufacturing thereofNICHIA CORP·Filed 2020·Granted Dec 6, 2022·0 cites·12 claims
- 2265US11929294B2Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrateNICHIA CORP·Filed 2021·Granted Mar 12, 2024·0 cites·7 claims
- 2365US9293642B2Light emitting device including light emitting element and wavelength converting member with regions having irregular atomic arrangmentsNICHIA CORP·Filed 2014·Granted Mar 22, 2016·0 cites·26 claims
- 2464US9553241B2Semiconductor light emitting device and method for producing the sameNICHIA CORP·Filed 2015·Granted Jan 24, 2017·1 cites·18 claims
- 2562US10777715B2Semiconductor light emitting deviceNICHIA CORP·Filed 2018·Granted Sep 15, 2020·0 cites·13 claims
- 2660US10658545B2Light emitting device in which light emitting element and light transmissive member are directly bondedNICHIA CORP·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 2759US10636941B2Light emitting device, and method for manufacturing thereofNICHIA CORP·Filed 2017·Granted Apr 28, 2020·0 cites·20 claims
- 2857US9847452B2Light emitting device, and method for manufacturing thereofNICHIA CORP·Filed 2014·Granted Dec 19, 2017·0 cites·11 claims
- 2956US9502608B2Method of manufacturing a light emitting device in which light emitting element and light transmissive member are directly bondedICHIKAWA MASATSUGU·Filed 2011·Granted Nov 22, 2016·0 cites·10 claims
- 3055US11837679B2Display deviceUNIV TOHOKU·Filed 2021·Granted Dec 5, 2023·0 cites·13 claims
- 3155US10043948B2Light emitting device in which light emitting element and light transmissive member are directly bondedNICHIA CORP·Filed 2016·Granted Aug 7, 2018·0 cites·13 claims
- 3254US10593843B2Method of manufacturing optical componentNICHIA CORP·Filed 2018·Granted Mar 17, 2020·0 cites·20 claims
- 3350US10415795B2Method of manufacturing light distribution member with shielded individual transmissive pieces and light-shielding frame, method of manufacturing light emitting device having light distribution member, light distribution member, and light emitting deviceNICHIA CORP·Filed 2016·Granted Sep 17, 2019·0 cites·19 claims
- 3446US8889443B2Method of forming light converting layer, method of manufacturing light converting member, and method of manufacturing light emitting deviceICHIKAWA MASATSUGU·Filed 2011·Granted Nov 18, 2014·0 cites·22 claims
- 3542US10234081B2Light-emitting device and method of manufacturing the sameNICHIA CORP·Filed 2017·Granted Mar 19, 2019·0 cites·18 claims
- 3642US9991434B2Semiconductor device with metal-bonded heat dissipator and manufacturing method for the sameNICHIA CORP·Filed 2015·Granted Jun 5, 2018·0 cites·16 claims
- 3740US10461235B2Method of manufacturing semiconductor deviceNICHIA CORP·Filed 2017·Granted Oct 29, 2019·0 cites·20 claims
- 3838US10115877B2Method for manufacturing semiconductor deviceNICHIA CORP·Filed 2017·Granted Oct 30, 2018·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Masatsugu Ichikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →