Inventor · disambiguated record
Manabu Iguchi
Also filed as: IGUCHI MANABU
20 granted patents·6 pending applications·565 citations·filing 1998–2012
95Inventor score
Top patents by PatentIndex Score
26 records- 0197US6841880B2Semiconductor device and method of fabricating semiconductor device with high CMP uniformity and resistance to loss that occurs in dicingNEC ELECTRONICS CORP·Filed 2003·Granted Jan 11, 2005·294 cites·9 claims
- 0291US6225697B1Semiconductor device and method for manufacturing the sameNEC CORP·Filed 2000·Granted May 1, 2001·69 cites·19 claims
- 0387US9337093B2Method of manufacturing semiconductor deviceOSHIDA DAISUKE·Filed 2011·Granted May 10, 2016·10 cites·4 claims
- 0484US8946800B2Semiconductor device with protective layer and method of manufacturing sameKUME IPPEI·Filed 2012·Granted Feb 3, 2015·8 cites·26 claims
- 0583US6876064B2Semiconductor device having superior resistance to moistureNEC ELECTRONICS CORP·Filed 2004·Granted Apr 5, 2005·36 cites·14 claims
- 0678US7138700B2Semiconductor device with guard ring for preventing water from entering circuit region from outsideNEC ELECTRONICS CORP·Filed 2004·Granted Nov 21, 2006·26 cites·18 claims
- 0778US6149730AApparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductorNEC CORP·Filed 1998·Granted Nov 21, 2000·50 cites·16 claims
- 0875US6379782B2Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the sameNEC CORP·Filed 2001·Granted Apr 30, 2002·21 cites·3 claims
- 0975US6376363B1Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereonNEC CORP·Filed 2000·Granted Apr 23, 2002·23 cites·5 claims
- 1067US7358609B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Apr 15, 2008·4 cites·9 claims
- 1164US7019400B2Semiconductor device having multilayer interconnection structure and method for manufacturing the deviceNEC ELECTRONICS CORP·Filed 2004·Granted Mar 28, 2006·12 cites·18 claims
- 1262US8158446B2Semiconductor device and method of manufacturing the sameIGUCHI MANABU·Filed 2009·Granted Apr 17, 2012·2 cites·9 claims
- 1354US6458690B2Method for manufacturing a multilayer interconnection structureNEC CORP·Filed 2001·Granted Oct 1, 2002·6 cites·7 claims
- 1453US7955980B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 7, 2011·0 cites·7 claims
- 1550US7601640B2Method of manfacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Granted Oct 13, 2009·0 cites·9 claims
- 1650US6555911B1Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratiosNEC ELECTRONICS CORP·Filed 2000·Granted Apr 29, 2003·4 cites·7 claims
- 1749US2010141806A1Moving Object Noise Elimination Processing Device and Moving Object Noise Elimination Processing ProgramKANSAI UNIVERSITY·Filed 2008·Application pending·0 cites
- 1846US8487305B2Semiconductor device and method of manufacturing the sameIGUCHI MANABU·Filed 2012·Granted Jul 16, 2013·0 cites·7 claims
- 1943US8329584B2Method of manufacturing semiconductor deviceTAKEWAKI TOSHIYUKI·Filed 2011·Granted Dec 11, 2012·0 cites·14 claims
- 2038US6861759B2Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the sameNEC ELECTRONICS CORP·Filed 2003·Granted Mar 1, 2005·0 cites·8 claims
- 2137US2004155350A1Semiconductor device having multi-layer interconnection structureFiled 2004·Application pending·0 cites
- 2237US2003039845A1Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the sameFiled 2002·Application pending·0 cites
- 2337US2010176483A1Fuse element and semiconductor integrated circuit with the sameNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 2436US7052994B2Method for manufacturing semiconductor device, and processing system and semiconductor deviceNEC ELECTRONICS CORP·Filed 2001·Granted May 30, 2006·0 cites·12 claims
- 2536US2002168812A1Semiconductor device with multilayer wiring structure of laminated damascene wiring and fabrication method thereofFiled 2001·Application pending·0 cites
- 2634US2010327447A1Method of manufacturing semiconductor device and semiconductor deviceNEC ELECTRONICS CORP·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Manabu Iguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →