Inventor · disambiguated record
Masashi Ikawa
Also filed as: IKAWA Masashi
6 granted patents·3 pending applications·8 citations·filing 2013–2021
71Inventor score
Top patents by PatentIndex Score
9 records- 0182US9718910B2Article and active energy ray-curable resin compositionMITSUBISHI RAYON CO·Filed 2013·Granted Aug 1, 2017·5 cites·19 claims
- 0272US9605355B2Method for producing anodic porous alumina, method for producing molded article having microscopic pattern on surface, and molded article having microscopic pattern on surfaceMITSUBISHI RAYON CO·Filed 2013·Granted Mar 28, 2017·1 cites·7 claims
- 0371US9797059B2Method for manufacturing mold and method for manufacturing molded article having fine uneven structure on surfaceMITSUBISHI CHEM CORP·Filed 2013·Granted Oct 24, 2017·2 cites·18 claims
- 0453US9908265B2Method of manufacturing mold, and molded article having fine relief structure on surface and method of manufacturing the sameMITSUBISHI RAYON CO·Filed 2013·Granted Mar 6, 2018·0 cites·14 claims
- 0548US12297301B2High-molecular-weight compound and method for producing same, composition and method for producing same, resin composition, additive for lubricating oil, and lubricating oilMITSUBISHI CHEM CORP·Filed 2021·Granted May 13, 2025·0 cites·19 claims
- 0647US10435553B2Resin composition, molded article and film including vinylidene fluoride-based resinMITSUBISHI CHEM CORP·Filed 2018·Granted Oct 8, 2019·0 cites·14 claims
- 0741US2015125659A1LaminateMITSUBISHI RAYON CO·Filed 2013·Application pending·0 cites
- 0836US2017096553A1Resin composition and molded body formed from resin compositionMITSUBISHI RAYON CO·Filed 2015·Application pending·0 cites
- 0936US2018127532A1Resin composition and film comprising resin compositionMITSUBISHI CHEM CORP·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masashi Ikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →