Inventor · disambiguated record
Maki Ikebe
Also filed as: IKEBE Maki
7 granted patents·1 pending application·7 citations·filing 2017–2022
73Inventor score
Top patents by PatentIndex Score
8 records- 0187US10548217B1Base material for printed interconnect boards and manufacturing method of printed interconnect boardsSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Jan 28, 2020·6 cites·10 claims
- 0276US11672082B2Printed wiring board production method and printed wiring board production apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Granted Jun 6, 2023·0 cites·13 claims
- 0370US11653454B2Printed wiring board and manufacturing method thereofSUMITOMO ELECTRIC PRINTED CIRCUITS INC·Filed 2021·Granted May 16, 2023·0 cites·7 claims
- 0469US11979983B2Printed wiring board and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted May 7, 2024·1 cites·7 claims
- 0563US12267952B2Flexible printed wiring board and method of manufacturing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Apr 1, 2025·0 cites·7 claims
- 0661US2024221998A1Coil deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 0757US11330718B2Printed wiring board production method and printed wiring board production apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted May 10, 2022·0 cites·8 claims
- 0857US11140784B2Printed wiring board and manufacturing method thereofSUMITOMO ELECTRIC PRINTED CIRCUITS INC·Filed 2017·Granted Oct 5, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →