Inventor · disambiguated record
Masahiko Ikeya
Also filed as: IKEYA MASAHIKO
12 granted patents·1 pending application·82 citations·filing 1998–2007
90Inventor score
Top patents by PatentIndex Score
13 records- 0177US7014092B2Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 21, 2006·16 cites·9 claims
- 0269US7516878B2Bump formation method and bump forming apparatus for semiconductor waferPANASONIC CORP·Filed 2005·Granted Apr 14, 2009·2 cites·6 claims
- 0369US7021357B2Component mounting apparatus and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 4, 2006·13 cites·8 claims
- 0463US6910613B2Device and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 28, 2005·8 cites·12 claims
- 0560US7350684B2Apparatus and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 1, 2008·2 cites·13 claims
- 0659US7052984B2Bump formation method and bump forming apparatus for semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 30, 2006·6 cites·24 claims
- 0756US7387229B2Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 17, 2008·4 cites·7 claims
- 0856US6098868ABump forming method and bump bonderMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Aug 8, 2000·23 cites·2 claims
- 0954US7005368B1Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 28, 2006·3 cites·8 claims
- 1054US2008179378A1Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeIMANISHI MAKOTO·Filed 2007·Application pending·0 cites
- 1147US7031509B2Method and apparatus for correcting inclination of IC on semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 18, 2006·2 cites·15 claims
- 1240US6818975B1Electric charge generating semiconductor substrate bump forming device, method of removing electric charge from electric charge generating semiconductor substrate device for removing electric charge from electric charge generating semiconductor substrate, and electric charge generating semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 16, 2004·0 cites·29 claims
- 1334US6787391B1Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 7, 2004·3 cites·22 claims
Join the waitlist — get patent alerts
Get an alert when Masahiko Ikeya files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →