Inventor · disambiguated record
Masamitsu Ikumo
Also filed as: IKUMO MASAMITSU
17 granted patents·5 pending applications·410 citations·filing 2000–2016
94Inventor score
Top patents by PatentIndex Score
22 records- 0195US6548898B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Apr 15, 2003·98 cites·28 claims
- 0293US7064436B2Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2004·Granted Jun 20, 2006·81 cites·2 claims
- 0390US6836025B2Semiconductor device configured to be surface mountableFUJITSU LTD·Filed 2003·Granted Dec 28, 2004·61 cites·16 claims
- 0489US7417326B2Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2006·Granted Aug 26, 2008·17 cites·6 claims
- 0583US6784543B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·30 cites·35 claims
- 0682US10008432B2Semiconductor device, manufacturing method thereof, and electronic apparatusSOCIONEXT INC·Filed 2016·Granted Jun 26, 2018·4 cites·17 claims
- 0780US6437432B2Semiconductor device having improved electrical characteristics and method of producing the sameFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·30 cites·17 claims
- 0876US6420213B1Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesiveFUJITSU LTD·Filed 2000·Granted Jul 16, 2002·27 cites·11 claims
- 0974US6600217B2Mounting substrate and mounting method for semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jul 29, 2003·22 cites·10 claims
- 1073US7247950B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2004·Granted Jul 24, 2007·18 cites·13 claims
- 1168US7355124B2Multilayer wiring board and its manufacturing methodFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·1 claims
- 1266US8420522B2Semiconductor device and manufacturing method of the sameIKUMO MASAMITSU·Filed 2008·Granted Apr 16, 2013·4 cites·5 claims
- 1358US7233076B2Semiconductor device with read out prevention and method of producing sameFUJITSU LTD·Filed 2004·Granted Jun 19, 2007·7 cites·9 claims
- 1456US6515347B1Wafer level semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2000·Granted Feb 4, 2003·7 cites·11 claims
- 1554US7915538B2Multilayer wiring board and its manufacturing methodFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Mar 29, 2011·0 cites·1 claims
- 1646US2006258045A1Semiconductor device and method of fabricating the sameFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1745US8093148B2Method for manufacturing semiconductor device having electrode for external connectionMAKINO YUTAKA·Filed 2009·Granted Jan 10, 2012·0 cites·13 claims
- 1841US2006175686A1Semiconductor device and fabrication method thereofFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1941US2005074971A1Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2040US6734042B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2002·Granted May 11, 2004·0 cites·8 claims
- 2140US2006214296A1Semiconductor device and semiconductor-device manufacturing methodFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2233US2012129335A1Method of manufacturing semiconductor deviceIKUMO MASAMITSU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →