Inventor · disambiguated record
Makoto Imanishi
Also filed as: IMANISHI MAKOTO
22 granted patents·1 pending application·303 citations·filing 1995–2009
96Inventor score
Top patents by PatentIndex Score
23 records- 0185US6017812ABump bonding method and bump bonding apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jan 25, 2000·82 cites·3 claims
- 0276US6302317B1Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 16, 2001·28 cites·6 claims
- 0373US5783915ALinear actuating apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Jul 21, 1998·38 cites·10 claims
- 0472US6329640B1Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 11, 2001·13 cites·16 claims
- 0569US6494358B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 17, 2002·10 cites·7 claims
- 0664US6527905B1Method for mounting electronic components and apparatus and dispenser used in the methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 4, 2003·9 cites·13 claims
- 0763US6910613B2Device and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 28, 2005·8 cites·12 claims
- 0863US6332268B1Method and apparatus for packaging IC chip, and tape-shaped carrier to be used thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 25, 2001·21 cites·38 claims
- 0960US7350684B2Apparatus and method for forming bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 1, 2008·2 cites·13 claims
- 1060US6568580B2Bump bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 27, 2003·6 cites·2 claims
- 1157US7246430B2Electronic component mounting apparatus and electronic component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 24, 2007·6 cites·18 claims
- 1257US5667130AUltrasonic wire bonding apparatus and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Sep 16, 1997·24 cites·17 claims
- 1356US7387229B2Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 17, 2008·4 cites·7 claims
- 1454US2008179378A1Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus thereforeIMANISHI MAKOTO·Filed 2007·Application pending·0 cites
- 1553US6392202B2Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor waferMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 21, 2002·3 cites·4 claims
- 1651US6206066B1Apparatus for mounting an electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Mar 27, 2001·12 cites·18 claims
- 1748US8358018B2Resin sealing structure for electronic component and resin sealing method for electronic componentPANASONIC CORP·Filed 2009·Granted Jan 22, 2013·0 cites·2 claims
- 1845US6619535B1Working method for holding a work object by suctionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 16, 2003·13 cites·10 claims
- 1940US6328196B1Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 11, 2001·8 cites·5 claims
- 2039US5899375ABump bonder with a discard bonding areaMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 4, 1999·8 cites·2 claims
- 2138US6481616B2Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·7 claims
- 2235US5899140ABump levelling method and bump levelling apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 4, 1999·5 cites·9 claims
- 2334US6787391B1Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Sep 7, 2004·3 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →