Inventor · disambiguated record
Masatoshi Inaba
Also filed as: INABA MASATOSHI · KUROSAKA AKIHITO
9 granted patents·254 citations·filing 1999–2023
88Inventor score
Top patents by PatentIndex Score
9 records- 0191US6835595B1Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor packageFUJIKURA LTD·Filed 2000·Granted Dec 28, 2004·60 cites·8 claims
- 0290US7023088B2Semiconductor package, semiconductor device and electronic deviceTEXAS INSTRUMENTS JAPAN·Filed 2003·Granted Apr 4, 2006·53 cites·9 claims
- 0387US7157363B2Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portionTEXAS INSTRUMENTS JAPAN·Filed 2004·Granted Jan 2, 2007·39 cites·11 claims
- 0486US6387734B1Semiconductor package, semiconductor device, electronic device and production method for semiconductor packageFUJIKURA LTD·Filed 1999·Granted May 14, 2002·94 cites·15 claims
- 0576US11638351B2Component-embedded substrateFUJIKURA LTD·Filed 2019·Granted Apr 25, 2023·2 cites·4 claims
- 0673US7476812B2Printed circuit board and manufacturing method thereofFUJIKURA LTD·Filed 2006·Granted Jan 13, 2009·5 cites·7 claims
- 0768US11979986B2Component-embedded substrateFUJIKURA LTD·Filed 2023·Granted May 7, 2024·0 cites·5 claims
- 0860US9006579B2Method of manufacturing printed circuit board and printed circuit boardINABA MASATOSHI·Filed 2012·Granted Apr 14, 2015·1 cites·3 claims
- 0946US8282841B2Printed circuit board and manufacturing method thereofNAKAJIMA KANAKO·Filed 2008·Granted Oct 9, 2012·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →