Inventor · disambiguated record
Masahiro Inohara
Also filed as: INOHARA MASAHIRO
19 granted patents·6 pending applications·236 citations·filing 1996–2024
94Inventor score
Top patents by PatentIndex Score
25 records- 0191US7325225B2Method and apparatus for reducing OPC model errorsTANAKA YASUSHI·Filed 2005·Granted Jan 29, 2008·17 cites·5 claims
- 0290US8546518B2Polyarylene sulfide and method for producing the sameUNOHARA TAKESHI·Filed 2010·Granted Oct 1, 2013·18 cites·7 claims
- 0385US7994641B2Semiconductor device and method of fabricating the sameTOSHIBA KK·Filed 2009·Granted Aug 9, 2011·11 cites·9 claims
- 0481US6894331B2MIM capacitor having flat diffusion prevention filmsTOSHIBA KK·Filed 2000·Granted May 17, 2005·27 cites·23 claims
- 0580US8629437B2Semiconductor device and manufacturing method thereofISHIDA TATSUYA·Filed 2011·Granted Jan 14, 2014·6 cites·7 claims
- 0679US6163067ASemiconductor apparatus having wiring groove and contact hole in self-alignment mannerTOSHIBA KK·Filed 1998·Granted Dec 19, 2000·49 cites·19 claims
- 0772US10615115B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2018·Granted Apr 7, 2020·1 cites·10 claims
- 0872US5976972AMethod of making semiconductor apparatus having wiring groove and contact hole formed in a self-alignment mannerTOSHIBA KK·Filed 1996·Granted Nov 2, 1999·38 cites·33 claims
- 0971US9576948B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Feb 21, 2017·2 cites·18 claims
- 1070US5966634AMethod of manufacturing semiconductor device having multi-layer wiring structure with diffusion preventing filmTOSHIBA KK·Filed 1997·Granted Oct 12, 1999·41 cites·43 claims
- 1164US10957641B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2020·Granted Mar 23, 2021·0 cites·9 claims
- 1261US6462248B1Method for producing aromatic compounds having alkyl group with at least three carbon atomsTORAY INDUSTRIES·Filed 1999·Granted Oct 8, 2002·8 cites·10 claims
- 1361US2024284684A1Semiconductor device and manufacturing method thereofKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1457US8102059B2Interconnect structure for high frequency signal transmissionsINOHARA MASAHIRO·Filed 2009·Granted Jan 24, 2012·1 cites·8 claims
- 1550US2010249342A1Process for production of polyphenylene sulfide resinTORAY INDUSTRIES·Filed 2007·Application pending·0 cites
- 1647US8970048B2Interconnect structure for high frequency signal transmissionsINOHARA MASAHIRO·Filed 2011·Granted Mar 3, 2015·0 cites·8 claims
- 1747US8252692B2Semiconductor device and method of fabricating the sameINOHARA MASAHIRO·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 1844US7045415B2MIM capacitor having flat diffusion prevention filmsTOSHIBA KK·Filed 2004·Granted May 16, 2006·2 cites·5 claims
- 1942US5948698AManufacturing method of semiconductor device using chemical mechanical polishingTOSHIBA KK·Filed 1997·Granted Sep 7, 1999·9 cites·22 claims
- 2042US2015263090A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2142US2008122038A1Guard ring structure with metallic materialsTOSHIBA AMERICA ELECTRONIC·Filed 2006·Application pending·0 cites
- 2240US2008122058A1Partially stacked semiconductor devicesINOHARA MASAHIRO·Filed 2006·Application pending·0 cites
- 2340US2003102530A1Semiconductor wafer, method of manufacturing the same and semiconductor deviceTOSHIBA KK·Filed 2003·Application pending·0 cites
- 2438US6525402B1Semiconductor wafer, method of manufacturing the same and semiconductor deviceTOSHIBA KK·Filed 1999·Granted Feb 25, 2003·6 cites·6 claims
- 2532US9318548B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted Apr 19, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →