Inventor · disambiguated record
Masahiro Ishitsuka
Also filed as: ISHITSUKA MASAHIRO
3 granted patents·68 citations·filing 1992–2001
72Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0170US6347655B1Die bonding device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Feb 19, 2002·20 cites·19 claims
- 0267US5291059AResin-molded semiconductor device and lead frame employed for fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Mar 1, 1994·42 cites·5 claims
- 0351US6320259B1Semiconductor device, and a manufacturing apparatus for a method of manufacturing the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 20, 2001·6 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →