Inventor · disambiguated record
Masanobu Iwasaki
Also filed as: IWASAKI MASANOBU
15 granted patents·1,054 citations·filing 1989–2007
95Inventor score
Top patents by PatentIndex Score
15 records- 0198US5174881AApparatus for forming a thin film on surface of semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 29, 1992·448 cites·4 claims
- 0297US5407867AMethod of forming a thin film on surface of semiconductor substrateMITSUBISHKI DENKI KABUSHIKI KA·Filed 1992·Granted Apr 18, 1995·380 cites·10 claims
- 0386US6568996B2Polishing agent for processing semiconductor, dispersant used therefor and process for preparing semiconductor device using above polishing agent for processing semiconductorMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 27, 2003·38 cites·8 claims
- 0480US5470799AMethod for pretreating semiconductor substrate by photochemically removing native oxideMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Nov 28, 1995·54 cites·10 claims
- 0571US7258598B2Polishing solution supply system, method of supplying polishing solution, apparatus for and method of polishing semiconductor substrate and method of manufacturing semiconductor deviceRENESAS TECH CORP·Filed 2001·Granted Aug 21, 2007·11 cites·11 claims
- 0670US6602725B2Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 5, 2003·11 cites·7 claims
- 0769US5429991AMethod of forming thin film for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 4, 1995·39 cites·14 claims
- 0866US7465221B2Polishing apparatusRENESAS TECH CORP·Filed 2007·Granted Dec 16, 2008·2 cites·1 claims
- 0962US6727170B2Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Apr 27, 2004·11 cites·3 claims
- 1061US7465216B2Polishing apparatusRENESAS TECH CORP·Filed 2007·Granted Dec 16, 2008·1 cites·1 claims
- 1154US5240505AMethod of an apparatus for forming thin film for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Aug 31, 1993·21 cites·16 claims
- 1244US6303944B1Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured therebyMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 16, 2001·9 cites·5 claims
- 1343US6278187B1Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 21, 2001·11 cites·8 claims
- 1443US5945716ASemiconductor wafer and device structureMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Aug 31, 1999·10 cites·20 claims
- 1542US6211070B1Peripheral structure of a chip as a semiconductor device, and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 3, 2001·8 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →