Inventor · disambiguated record
Mahadevan Iyer
Also filed as: IYER MAHADEVAN K · IYER MAHADEVAN KRISHNA
10 granted patents·4 pending applications·219 citations·filing 2001–2008
89Inventor score
Files withAGENCY SCIENCE TECH & RES4INST OF MICROELECTRONICS4GEORGIA TECH RES INST3GEORGIA TECH RES COPORATION1MITSUBISHI ELECTRIC CORP1
Top patents by PatentIndex Score
14 records- 0191US6717812B1Apparatus and method for fluid-based cooling of heat-generating devicesINST OF MICROELECTRONICS·Filed 2003·Granted Apr 6, 2004·113 cites·19 claims
- 0280US6608379B2Enhanced chip scale package for flip chipsINST OF MICROELECTRONICS·Filed 2002·Granted Aug 19, 2003·40 cites·30 claims
- 0373US6787456B1Wafer-level inter-connector formation methodAGENCY SCIENCE TECH & RES·Filed 2003·Granted Sep 7, 2004·21 cites·29 claims
- 0461US6879287B2Packaged integrated antenna for circular and linear polarizationsAGENCY SCIENCE TECH & RES·Filed 2003·Granted Apr 12, 2005·14 cites·25 claims
- 0553US6599138B1High frequency board-to-board connectorINST OF MICROELECTRONICS·Filed 2002·Granted Jul 29, 2003·12 cites·21 claims
- 0651US7178711B2Method and device to elongate a solder jointGEORGIA TECH RES INST·Filed 2003·Granted Feb 20, 2007·5 cites·12 claims
- 0750US7189594B2Wafer level packages and methods of fabricationAGENCY SCIENCE TECH & RES·Filed 2004·Granted Mar 13, 2007·5 cites·25 claims
- 0850US6710438B2Enhanced chip scale package for wire bond diesINST OF MICROELECTRONICS·Filed 2002·Granted Mar 23, 2004·8 cites·31 claims
- 0945US2007114266A1Method and device to elongate a solder jointGEORGIA TECH RES INST·Filed 2007·Application pending·0 cites
- 1043US7977758B2Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architecturesGEORGIA TECH RES INST·Filed 2008·Granted Jul 12, 2011·0 cites·15 claims
- 1137US2010170086A1Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrateAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 1235US6617667B2Optical device carrierMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Sep 9, 2003·1 cites·20 claims
- 1334US2002175424A1Process of forming metal surfaces compatible with a wire bonding and semiconductor integrated circuits manufactured by the processFiled 2002·Application pending·0 cites
- 1433US2007040565A1Compliant probes and test methodology for fine pitch wafer level devices and interconnectsGEORGIA TECH RES COPORATION·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →